Loading...

STB60N55F3TRL

STMicroelectronics

STB60N55F3TRL by STMicroelectronics

STB60N55F3TRL from STMicroelectronics is a high-performance N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, breakdown voltage of 55 V, and low on-resistance of 0.0085 Ω. Ideal for power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,549

-

-

-

-

Vyrian

USA . 1,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,921

-

-

-

-

Anansix

USA . 884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

884

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,902 parts In-Stock

1+ parts

$0.615

100+ parts

-

1k+ parts

$0.553

10k+ parts

-

1,902

$0.615

-

$0.553

-

MKK Technologies

India . 1,429 parts In-Stock

1+ parts

$1.156

100+ parts

-

1k+ parts

-

10k+ parts

-

1,429

$1.156

-

-

-

DigiPath Technology Company

USA . 1,429 parts In-Stock

1+ parts

$1.156

100+ parts

-

1k+ parts

-

10k+ parts

-

1,429

$1.156

-

-

-

Corphita

USA . 2,564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,564

-

-

-

-

Parana Technologies

USA . 765 parts In-Stock

1+ parts

-

100+ parts

$0.735

1k+ parts

-

10k+ parts

-

765

-

$0.735

-

-

Overview

Elevate your designs with the STB60N55F3TRL from STMicroelectronics, a trusted leader in semiconductor innovation. This powerful N-channel FET excels in switching applications, delivering unparalleled efficiency and reliability for your projects. With its compact design and robust performance, it reduces energy loss while handling high currents effortlessly. Count on STMicroelectronics for quality that drives your success, empowering you to create cutting-edge solutions with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making this FET suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer lower on-resistance and higher efficiency, making this FET a great choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for better performance in switching applications, reducing component count and saving space on the PCB.

Transistor Application: SWITCHING

Optimized for switching, this FET provides fast response times, making it ideal for power management and control circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, enhancing manufacturing efficiency.

Minimum DS Breakdown Voltage: 55 V

A minimum breakdown voltage of 55V ensures reliability in high-voltage applications, providing margin for various operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to efficient space utilization on PCBs, fitting easily into modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and improve mechanical stability, ensuring reliable connections in the final application.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables the FET to turn on efficiently, resulting in lower conduction losses during operation.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed current rating makes this FET capable of handling significant surges, which is essential for applications dealing with transient loads.

Avalanche Energy Rating (EAS): 390 mJ

This energy rating highlights the robustness of the FET, making it suitable for applications that may experience inductive kickback.

No. of Terminals: 2

With only two terminals, the design is simplified, facilitating easier integration into circuits and reducing potential points of failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, supporting higher density designs within compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high speed and low power consumption, making this device ideal for modern high-performance applications.

Maximum Operating Temperature: 175 °C

The ability to operate at temperatures up to 175 °C enhances reliability in demanding environments, suitable for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon is a widely used and reliable material known for its excellent semiconductor properties, ensuring the performance of the FET.

Maximum Drain Current (ID): 80 A

A maximum drain current of 80A allows the FET to drive heavy loads effectively, making it suitable for power supply and motor control applications.

Maximum Drain-Source On Resistance: 0.0085 ohm

Very low on-resistance minimizes power loss, improving overall efficiency in power delivery and thermal performance of the system.

Terminal Position: SINGLE

Single terminal position simplifies layout and design requirements, making the FET easy to integrate into various circuit configurations.

Case Connection: DRAIN

DRAIN connection configuration supports straightforward designs, allowing efficient heat dissipation and improved electrical performance.

Technical Specifications

Power Field Effect Transistors (FET) STB60N55F3TRL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

390 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB60N55F3TRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19