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STB60N06-14-1

STMicroelectronics

STB60N06-14-1 by STMicroelectronics

STB60N06-14-1 by STMicroelectronics is an N-channel FET ideal for switching applications. It features a max drain current of 60 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Its compact design ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,981 parts In-Stock

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3,981

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Digiode

USA . 2,869 parts In-Stock

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2,869

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Anansix

USA . 1,001 parts In-Stock

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1,001

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$0.802

100+ parts

-

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$0.722

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$0.802

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$0.722

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MKK Technologies

India . 2,166 parts In-Stock

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$1.509

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2,166

$1.509

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DigiPath Technology Company

USA . 2,166 parts In-Stock

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$1.509

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2,166

$1.509

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Corphita

USA . 2,061 parts In-Stock

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2,061

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Parana Technologies

USA . 615 parts In-Stock

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$0.959

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615

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Overview

Elevate your design with the STB60N06-14-1 from STMicroelectronics, a powerhouse in Power FET technology. Renowned for unmatched reliability and performance, this N-channel transistor excels in switching applications, delivering robust efficiency and thermal management. Ideal for automotive and industrial solutions, its compact design and built-in diode offer versatility without compromising space. Choose STMicroelectronics for quality that powers innovation and drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides good thermal and mechanical stability, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configurations typically offer lower on-resistance and higher efficiency, which is beneficial for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier integration in switching applications, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast response and high reliability.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60 V allows for versatile usage in various power supply circuits.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, suitable for robust designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control and efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 240 A

With a high pulsed drain current rating, this FET is capable of handling transient conditions effectively.

Avalanche Energy Rating (EAS): 600 mJ

Good avalanche energy rating ensures protection against destructive transients, enhancing reliability.

Maximum Drain Current (Abs) (ID): 60 A

High maximum drain current supports demanding applications, allowing for powerful performance.

No. of Terminals: 3

The three-terminal design simplifies circuit configurations while allowing for various connection options.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability means this FET can operate effectively in high-power environments.

Package Style (Meter): IN-LINE

In-line package style is commonly used, making this FET easy to source and integrate into designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, which are advantageous for various applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature indicates robustness under extreme conditions, extending operational lifetime.

Transistor Element Material: SILICON

Silicon as the element material offers proven performance and reliability in diverse applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish enhances solderability and durability in electronic assembly.

Maximum Drain Current (ID): 60 A

Consistent maximum drain current rating ensures reliability under continuous operation in power applications.

Maximum Drain-Source On Resistance: 0.014 ohm

Low on-resistance improves efficiency and reduces heat generation during operation, which is ideal for power management.

Terminal Position: SINGLE

Single terminal positioning simplifies the design process and reduces layout complexity.

Case Connection: DRAIN

Direct drainage connection ensures efficient current flow management, crucial for power applications.

Technical Specifications

Power Field Effect Transistors (FET) STB60N06-14-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB60N06-14-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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