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STB21N65M5

STMicroelectronics

STB21N65M5 by STMicroelectronics

STB21N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 68A IDM, 400mJ EAS, and 0.19 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max power dissipation of 125W at 150°C.

Median Price

$3.636

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 423 parts In-Stock

1+ parts

$5.120

100+ parts

$2.640

1k+ parts

$2.390

10k+ parts

-

423

$5.120

$2.640

$2.390

-

DigiKey

USA . 3,954 parts In-Stock

1+ parts

$5.510

100+ parts

$2.632

1k+ parts

$2.083

10k+ parts

-

3,954

$5.510

$2.632

$2.083

-

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.153

10k+ parts

-

1,000

-

-

$2.153

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.117

10k+ parts

-

1,000

-

-

$2.117

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.823

100+ parts

-

1k+ parts

-

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10

$2.823

-

-

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Digiode

USA . 1,939 parts In-Stock

1+ parts

$4.456

100+ parts

-

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-

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1,939

$4.456

-

-

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Sensible Micro Corp

USA . 15,000 parts In-Stock

1+ parts

-

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15,000

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-

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ComSIT Distribution GmbH

Germany . 4,460 parts In-Stock

1+ parts

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4,460

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Vyrian

USA . 1,393 parts In-Stock

1+ parts

-

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1,393

-

-

-

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IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.320

10k+ parts

$4.264

1,000

-

-

$4.320

$4.264

TME

Poland . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.810

10k+ parts

-

1,000

-

-

$2.810

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Anansix

USA . 719 parts In-Stock

1+ parts

-

100+ parts

-

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719

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Dan-Mar Components

USA . 335 parts In-Stock

1+ parts

-

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335

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Bristol Electronics

USA . 85 parts In-Stock

1+ parts

-

100+ parts

$1.673

1k+ parts

-

10k+ parts

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85

-

$1.673

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$1.632

100+ parts

-

1k+ parts

$1.469

10k+ parts

-

2,087

$1.632

-

$1.469

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Ampacity Inc.

Singapore . 1,403 parts In-Stock

1+ parts

$1.820

100+ parts

-

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1,403

$1.820

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$2.767

100+ parts

-

1k+ parts

$2.656

10k+ parts

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500

$2.767

-

$2.656

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Argo Parts USA

USA . 3,629 parts In-Stock

1+ parts

$2.823

100+ parts

-

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10k+ parts

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3,629

$2.823

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-

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Continental Prestige Electronics

USA . 2,968 parts In-Stock

1+ parts

$2.823

100+ parts

-

1k+ parts

-

10k+ parts

$2.767

2,968

$2.823

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-

$2.767

MKK Technologies

India . 1,163 parts In-Stock

1+ parts

$3.069

100+ parts

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1,163

$3.069

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DigiPath Technology Company

USA . 1,163 parts In-Stock

1+ parts

$3.069

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1,163

$3.069

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Corphita

USA . 1,858 parts In-Stock

1+ parts

$4.221

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1,858

$4.221

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Microchip USA

USA . 9,535 parts In-Stock

1+ parts

$18.060

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9,535

$18.060

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Lixinc

USA . 11,344 parts In-Stock

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11,344

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Alle Elektronik GmbH

Germany . 4,685 parts In-Stock

1+ parts

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4,685

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Perfect Parts

USA . 4,573 parts In-Stock

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4,573

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Parana Technologies

USA . 1,337 parts In-Stock

1+ parts

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100+ parts

$1.951

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1,337

-

$1.951

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Overview

Unleash the power of innovation with the STB21N65M5 by STMicroelectronics. Crafted with precision and quality, this N-channel Power FET offers unparalleled performance in switching applications. With a high breakdown voltage of 650V and a maximum drain current of 17A, this transistor ensures reliability and efficiency. The built-in diode and enhancement mode operation provide seamless functionality, while the small outline package makes it easy to integrate into your designs. Elevate your projects with the STB21N65M5 and experience the next level of power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from reverse voltage spikes, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and fast switching capabilities, making it ideal for power management systems.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the FET on a PCB, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, providing protection against voltage spikes.

Avalanche Energy Rating (EAS): 400 mJ

The high avalanche energy rating ensures the FET can withstand transient events and overcurrent conditions without damage, enhancing the reliability of the product.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation capability allows the FET to handle high power levels without overheating, ensuring stable operation in demanding conditions.

Maximum Operating Temperature: 150 °C

The FET can operate effectively at high temperatures, making it suitable for applications where temperature variations are common.

Technical Specifications

Power Field Effect Transistors (FET) STB21N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB21N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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