Loading...

STB24N65M2

STMicroelectronics

STB24N65M2 by STMicroelectronics

STB24N65M2 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 64A IDM, 150W Abs Power Dissipation, and 0.23 ohm Drain-Source On Resistance. Suitable for ENHANCEMENT MODE operation in various electronic devices.

Median Price

$1.745

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$1.745

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$1.745

-

-

-

Vyrian

USA . 8,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,993

-

-

-

-

Digiode

USA . 3,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,344

-

-

-

-

Anansix

USA . 1,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,291

-

-

-

-

ComSIT Distribution GmbH

Germany . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

NexGen Digital

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,927 parts In-Stock

1+ parts

$1.126

100+ parts

-

1k+ parts

$1.013

10k+ parts

-

1,927

$1.126

-

$1.013

-

Continental Prestige Electronics

USA . 6,122 parts In-Stock

1+ parts

$1.745

100+ parts

-

1k+ parts

-

10k+ parts

$1.710

6,122

$1.745

-

-

$1.710

Argo Parts USA

USA . 1,157 parts In-Stock

1+ parts

$1.745

100+ parts

-

1k+ parts

-

10k+ parts

-

1,157

$1.745

-

-

-

MKK Technologies

India . 1,927 parts In-Stock

1+ parts

$2.118

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

$2.118

-

-

-

DigiPath Technology Company

USA . 1,927 parts In-Stock

1+ parts

$2.118

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

$2.118

-

-

-

AZTECH Wire

Italy . 380 parts In-Stock

1+ parts

$9.970

100+ parts

-

1k+ parts

-

10k+ parts

-

380

$9.970

-

-

-

Ampacity Inc.

Singapore . 767 parts In-Stock

1+ parts

$43.050

100+ parts

-

1k+ parts

-

10k+ parts

-

767

$43.050

-

-

-

RC Electronics

USA . 37,472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37,472

-

-

-

-

Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Alle Elektronik GmbH

Germany . 3,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,519

-

-

-

-

Perfect Parts

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,360

-

-

-

-

Lixinc

USA . 2,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,756

-

-

-

-

Corphita

USA . 2,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

-

-

-

-

Parana Technologies

USA . 483 parts In-Stock

1+ parts

-

100+ parts

$1.346

1k+ parts

-

10k+ parts

-

483

-

$1.346

-

-

Overview

Discover the unparalleled reliability and performance of the STB24N65M2 Power Field Effect Transistor by STMicroelectronics. With a sleek design and cutting-edge technology, this N-CHANNEL transistor is perfect for a variety of switching applications. Experience enhanced efficiency and power with its built-in diode and high breakdown voltage of 650V. From its small outline package to its maximum power dissipation of 150W, this transistor offers exceptional value and benefits to customers seeking quality and innovation in their electronic projects. Upgrade your systems today with the STB24N65M2 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the FET, making it resistant to physical damage.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The inclusion of a built-in diode in the FET simplifies circuit design and can improve efficiency by allowing easier control of current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and efficient power handling capabilities.

Surface Mount: YES

The surface mount capability of this FET allows for easy and convenient integration into printed circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650V ensures that the FET can handle high voltages without breakdown, making it suitable for applications with high voltage requirements.

Maximum Pulsed Drain Current (IDM): 64 A

The high pulsed drain current rating of 64A allows the FET to handle surges in current without damage, making it reliable for demanding applications.

Maximum Power Dissipation (Abs): 150 W

With a maximum power dissipation of 150W, this FET can handle high power levels without overheating, ensuring long-term reliability under heavy loads.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows this FET to operate reliably in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) STB24N65M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

650 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.23 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

64 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB24N65M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19