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STB270N4F3

STMicroelectronics

STB270N4F3 by STMicroelectronics

STB270N4F3 by STMicroelectronics is a N-CHANNEL FET with 40V DS Breakdown Voltage, 640A IDM, and 0.002 ohm RDS(on). Ideal for SWITCHING applications, it features a built-in diode, operates in ENHANCEMENT MODE, and has a max power dissipation of 330W.

Median Price

$4.630

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,947 parts In-Stock

1+ parts

$4.630

100+ parts

$2.170

1k+ parts

$1.890

10k+ parts

-

1,947

$4.630

$2.170

$1.890

-

DigiKey

USA . 1,376 parts In-Stock

1+ parts

$4.630

100+ parts

$2.171

1k+ parts

$1.669

10k+ parts

$1.650

1,376

$4.630

$2.171

$1.669

$1.650

EBV Elektronik

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$2.441

100+ parts

-

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-

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36

$2.441

-

-

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Digiode

USA . 4,855 parts In-Stock

1+ parts

$3.696

100+ parts

-

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4,855

$3.696

-

-

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

-

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3,000

-

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Anansix

USA . 2,713 parts In-Stock

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2,713

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TME

Poland . 2,000 parts In-Stock

1+ parts

-

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-

1k+ parts

$2.060

10k+ parts

-

2,000

-

-

$2.060

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Vyrian

USA . 1,820 parts In-Stock

1+ parts

-

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1,820

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-

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ComSIT Distribution GmbH

Germany . 1,500 parts In-Stock

1+ parts

-

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1,500

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ComSIT USA

USA . 1,500 parts In-Stock

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-

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1,500

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ACDS - Activité Composants Distribution Service

France . 215 parts In-Stock

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215

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,981 parts In-Stock

1+ parts

$1.827

100+ parts

-

1k+ parts

$1.644

10k+ parts

-

1,981

$1.827

-

$1.644

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$2.441

100+ parts

$2.319

1k+ parts

$2.203

10k+ parts

$2.172

1,000

$2.441

$2.319

$2.203

$2.172

Argo Parts USA

USA . 1,924 parts In-Stock

1+ parts

$2.441

100+ parts

-

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1,924

$2.441

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Continental Prestige Electronics

USA . 1,005 parts In-Stock

1+ parts

$2.441

100+ parts

-

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10k+ parts

$2.393

1,005

$2.441

-

-

$2.393

Ampacity Inc.

Singapore . 1,581 parts In-Stock

1+ parts

$3.310

100+ parts

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1,581

$3.310

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Semicontronic

India . 1,366 parts In-Stock

1+ parts

$3.310

100+ parts

$3.227

1k+ parts

$3.211

10k+ parts

-

1,366

$3.310

$3.227

$3.211

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MKK Technologies

India . 1,221 parts In-Stock

1+ parts

$3.436

100+ parts

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1,221

$3.436

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DigiPath Technology Company

USA . 1,221 parts In-Stock

1+ parts

$3.436

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1,221

$3.436

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Corphita

USA . 2,689 parts In-Stock

1+ parts

$3.501

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2,689

$3.501

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Microchip USA

USA . 6,113 parts In-Stock

1+ parts

$15.879

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6,113

$15.879

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Futuretech Components

Singapore . 11,000 parts In-Stock

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Perfect Parts

USA . 9,455 parts In-Stock

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Kepictronics

USA . 4,822 parts In-Stock

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4,822

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,970 parts In-Stock

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$2.185

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1,970

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$2.185

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Lixinc

USA . 962 parts In-Stock

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962

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Assy Fe

Spain . 300 parts In-Stock

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300

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Cyclops Electronics Ltd (Excess)

UK . 215 parts In-Stock

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215

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Overview

Discover the unparalleled performance and reliability of the STB270N4F3 by STMicroelectronics, a leading manufacturer in the industry. This power field effect transistor is designed for switching applications, offering enhanced efficiency and durability. With a maximum drain current of 160A and a low on-resistance of 0.002 ohm, this N-channel transistor delivers exceptional power handling capabilities. Whether you're designing industrial equipment or automotive systems, the STB270N4F3 provides the perfect solution for your high-power needs. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Minimum DS Breakdown Voltage: 40 V

Can handle higher voltages without breakdown, making it suitable for applications that require higher voltage tolerance.

Maximum Pulsed Drain Current (IDM): 640 A

Capable of handling high current spikes, ideal for applications with high transient currents.

Maximum Power Dissipation (Abs): 330 W

Can dissipate high power levels efficiently, ensuring reliable operation under heavy loads.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without degradation, suitable for harsh environments or applications that generate significant heat.

Maximum Drain-Source On Resistance: 0.002 ohm

Low on-resistance results in minimal power loss and improved efficiency, making it suitable for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) STB270N4F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

160 A

Maximum Drain Current (ID):

160 A

Maximum Drain-Source On Resistance:

.002 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

640 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB270N4F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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