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STB28NM50N

STMicroelectronics

STB28NM50N by STMicroelectronics

STB28NM50N by STMicroelectronics is a N-CHANNEL FET with 500V DS breakdown voltage, ideal for SWITCHING applications. Features include 84A max pulsed drain current, 0.158 ohm max drain-source resistance, and 150°C max operating temperature. Suitable for high-power switching circuits requiring fast response times.

Median Price

$6.440

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1 parts In-Stock

1+ parts

$5.100

100+ parts

$3.390

1k+ parts

$2.320

10k+ parts

-

1

$5.100

$3.390

$2.320

-

Mouser Electronics

USA . 922 parts In-Stock

1+ parts

$7.780

100+ parts

$4.070

1k+ parts

$3.800

10k+ parts

-

922

$7.780

$4.070

$3.800

-

DigiKey

USA . 1,066 parts In-Stock

1+ parts

$8.360

100+ parts

$4.157

1k+ parts

$3.320

10k+ parts

-

1,066

$8.360

$4.157

$3.320

-

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.831

10k+ parts

-

3,000

-

-

$2.831

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

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EBV Elektronik

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.025

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.025

-

-

-

Digiode

USA . 3,481 parts In-Stock

1+ parts

$6.194

100+ parts

-

1k+ parts

-

10k+ parts

-

3,481

$6.194

-

-

-

Vyrian

USA . 7,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,990

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-

-

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Anansix

USA . 2,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,818

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-

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Chip Stock

USA . 1,125 parts In-Stock

1+ parts

-

100+ parts

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1,125

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-

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

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1,000

-

-

-

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Sensible Micro Corp

USA . 625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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625

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.702

100+ parts

$0.639

1k+ parts

$0.576

10k+ parts

-

3,000

$0.702

$0.639

$0.576

-

IDEA Electronic Components Group

UK . 2,004 parts In-Stock

1+ parts

$1.429

100+ parts

-

1k+ parts

$1.286

10k+ parts

-

2,004

$1.429

-

$1.286

-

MKK Technologies

India . 1,924 parts In-Stock

1+ parts

$2.687

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

$2.687

-

-

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DigiPath Technology Company

USA . 1,924 parts In-Stock

1+ parts

$2.687

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

$2.687

-

-

-

Ampacity Inc.

Singapore . 1,806 parts In-Stock

1+ parts

$2.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,806

$2.980

-

-

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Argo Parts USA

USA . 2,701 parts In-Stock

1+ parts

$4.025

100+ parts

-

1k+ parts

-

10k+ parts

-

2,701

$4.025

-

-

-

Continental Prestige Electronics

USA . 1,497 parts In-Stock

1+ parts

$4.025

100+ parts

-

1k+ parts

-

10k+ parts

$3.944

1,497

$4.025

-

-

$3.944

Netroflash

USA . 50 parts In-Stock

1+ parts

$4.025

100+ parts

-

1k+ parts

-

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50

$4.025

-

-

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Corphita

USA . 4,656 parts In-Stock

1+ parts

$5.868

100+ parts

-

1k+ parts

-

10k+ parts

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4,656

$5.868

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Microchip USA

USA . 2,174 parts In-Stock

1+ parts

$24.973

100+ parts

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2,174

$24.973

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Lixinc

USA . 14,472 parts In-Stock

1+ parts

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14,472

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Perfect Parts

USA . 9,032 parts In-Stock

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9,032

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RC Electronics

USA . 7,323 parts In-Stock

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7,323

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Kepictronics

USA . 3,669 parts In-Stock

1+ parts

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100+ parts

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3,669

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

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-

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A-Z Elektronik GmbH

Germany . 1,125 parts In-Stock

1+ parts

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100+ parts

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1,125

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Epart123

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Parana Technologies

USA . 119 parts In-Stock

1+ parts

-

100+ parts

$1.708

1k+ parts

-

10k+ parts

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119

-

$1.708

-

-

Overview

Unleash the power of innovation with the STB28NM50N by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors that are designed for superior performance and reliability. Ideal for switching applications, this N-channel transistor offers maximum pulsing drain current and an impressive breakdown voltage, ensuring optimal efficiency and durability. With a robust design and advanced technology, the STB28NM50N is the perfect solution for your power management needs. Experience the difference with STMicroelectronics and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching capabilities in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and offers additional functionality with the built-in diode.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 500 V

Can withstand high voltages, making it suitable for a wide range of applications.

Terminal Form: GULL WING

Provides a secure connection for efficient power transfer.

Maximum Pulsed Drain Current (IDM): 84 A

Capable of handling high current loads without overheating.

Avalanche Energy Rating (EAS): 430 mJ

Can withstand high energy spikes, ensuring long-term reliability.

Maximum Drain Current (Abs) (ID): 21 A

Suitable for moderate current applications, offering versatility.

Maximum Power Dissipation (Abs): 90 W

Efficiently dissipates heat to prevent overheating during operation.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.158 ohm

Provides low resistance for efficient power flow when the FET is switched on.

Technical Specifications

Power Field Effect Transistors (FET) STB28NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

430 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.158 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB28NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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