Loading...

STB200NF04L-1

STMicroelectronics

STB200NF04L-1 by STMicroelectronics

STB200NF04L-1 by STMicroelectronics is a N-channel FET with 40V DS breakdown voltage, 120A max drain current, and 0.0043 ohm on-resistance. Ideal for switching applications due to its 480A pulsed drain current capability and built-in diode configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,613

-

-

-

-

Anansix

USA . 1,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,343

-

-

-

-

Digiode

USA . 1,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,139

-

-

-

-

Nova Conductors

Japan . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,250 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

-

10k+ parts

-

1,250

$0.740

-

-

-

IDEA Electronic Components Group

UK . 2,249 parts In-Stock

1+ parts

$1.047

100+ parts

-

1k+ parts

$0.942

10k+ parts

-

2,249

$1.047

-

$0.942

-

Corohmni

South Africa . 43 parts In-Stock

1+ parts

$1.813

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$1.813

-

-

-

MKK Technologies

India . 213 parts In-Stock

1+ parts

$1.969

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$1.969

-

-

-

DigiPath Technology Company

USA . 213 parts In-Stock

1+ parts

$1.969

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$1.969

-

-

-

AZTECH Wire

Italy . 383 parts In-Stock

1+ parts

$19.831

100+ parts

-

1k+ parts

-

10k+ parts

-

383

$19.831

-

-

-

Ampacity Inc.

Singapore . 1,481 parts In-Stock

1+ parts

$51.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,481

$51.050

-

-

-

Component Stockers USA

USA . 766 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

766

$99.990

-

-

-

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Alle Elektronik GmbH

Germany . 4,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,230

-

-

-

-

Argo Parts USA

USA . 4,044 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,044

-

-

-

-

Continental Prestige Electronics

USA . 3,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,029

-

-

-

-

Parana Technologies

USA . 1,899 parts In-Stock

1+ parts

-

100+ parts

$1.252

1k+ parts

-

10k+ parts

-

1,899

-

$1.252

-

-

Corphita

USA . 449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

449

-

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Experience the power of the STB200NF04L-1 by STMicroelectronics, a top-tier manufacturer known for its high-quality Power Field Effect Transistors. Ideal for switching applications, this N-CHANNEL transistor offers a single configuration with a built-in diode, providing enhanced efficiency and reliability. With a maximum operating temperature of 175°C and a low drain-source on resistance of 0.0043 ohm, this transistor delivers exceptional performance in a compact package. Trust STMicroelectronics to deliver cutting-edge technology that meets your power management needs with ease.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides good insulation and protection for the FET.

Polarity or Channel Type:

N-CHANNEL - N-channel FETs typically have lower ON resistance and better performance.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode helps protect against reverse current flow.

Transistor Application:

SWITCHING - Suitable for high-speed switching applications.

Minimum DS Breakdown Voltage:

40 V - Offers a good margin of safety for voltage spikes.

Package Shape:

RECTANGULAR - Allows for easy mounting and space-saving layout.

Terminal Form:

THROUGH-HOLE - Provides secure and reliable connections on a circuit board.

Operating Mode:

ENHANCEMENT MODE - Allows for easy control of the device's conductivity.

Maximum Pulsed Drain Current (IDM):

480 A - Suitable for high power applications.

Avalanche Energy Rating (EAS):

1400 mJ - Can withstand high energy spikes.

Maximum Drain Current (Abs) (ID):

120 A - Capable of handling high current loads.

No. of Terminals:

3 - Simple and easy to integrate into a circuit.

Maximum Power Dissipation (Abs):

300 W - Can handle high power dissipation without overheating.

Package Style (Meter):

IN-LINE - Provides a compact and streamlined design.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Offers high efficiency and performance.

Maximum Operating Temperature:

175 °C - Can operate reliably in high-temperature environments.

Transistor Element Material:

SILICON - Silicon is a common and reliable material for FETs.

Terminal Finish:

TIN LEAD - Provides good solderability and corrosion resistance.

Maximum Drain-Source On Resistance:

0.0043 ohm - Offers low ON resistance for efficient operation.

Terminal Position:

SINGLE - Simplifies circuit design and connection setup.

Technical Specifications

Power Field Effect Transistors (FET) STB200NF04L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1400 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB200NF04L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19