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STB270N04

STMicroelectronics

STB270N04 by STMicroelectronics

STB270N04 by STMicroelectronics is a N-CHANNEL FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. It features 640A IDM, 1000mJ EAS, and 0.0025 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 175°C and can handle up to 330W power dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,682 parts In-Stock

1+ parts

-

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1,682

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Anansix

USA . 1,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,665

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Vyrian

USA . 1,093 parts In-Stock

1+ parts

-

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1,093

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,545 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

$1.575

10k+ parts

-

1,545

$1.750

-

$1.575

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MKK Technologies

India . 1,378 parts In-Stock

1+ parts

$3.290

100+ parts

-

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10k+ parts

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1,378

$3.290

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DigiPath Technology Company

USA . 1,378 parts In-Stock

1+ parts

$3.290

100+ parts

-

1k+ parts

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10k+ parts

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1,378

$3.290

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Semicontronic

India . 335 parts In-Stock

1+ parts

$13.050

100+ parts

$12.724

1k+ parts

$12.658

10k+ parts

-

335

$13.050

$12.724

$12.658

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AZTECH Wire

Italy . 830 parts In-Stock

1+ parts

$18.707

100+ parts

-

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10k+ parts

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830

$18.707

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Ampacity Inc.

Singapore . 1,599 parts In-Stock

1+ parts

$45.050

100+ parts

-

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10k+ parts

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1,599

$45.050

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Kepictronics

USA . 15,000 parts In-Stock

1+ parts

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15,000

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Argo Parts USA

USA . 4,920 parts In-Stock

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4,920

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Corphita

USA . 2,481 parts In-Stock

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2,481

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Continental Prestige Electronics

USA . 1,511 parts In-Stock

1+ parts

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1,511

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Parana Technologies

USA . 1,186 parts In-Stock

1+ parts

-

100+ parts

$2.092

1k+ parts

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10k+ parts

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1,186

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$2.092

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

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100+ parts

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200

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Overview

Unleash the power of innovation with the STB270N04 by STMicroelectronics, a top-tier manufacturer known for its cutting-edge technology. As a high-quality Power Field Effect Transistor, this product offers unparalleled performance in switching applications. With a maximum drain current of 120A and a low on-resistance of 0.0025 ohms, the STB270N04 delivers superior efficiency and reliability. Whether you're designing industrial equipment or automotive systems, this N-CHANNEL transistor with built-in diode is the perfect solution for your power management needs. Upgrade to STMicroelectronics and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability, making this FET a great choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel polarity type allows for efficient and effective switching, making this FET a reliable choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this single configuration FET simplifies circuit design and enhances performance, making it an excellent choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and efficiency, making it a top choice for power systems.

Surface Mount: YES

The surface mount capability of this FET allows for easy and convenient installation, making it a versatile choice for various electronic devices.

Minimum DS Breakdown Voltage: 40 V

With a 40V minimum breakdown voltage, this FET offers reliable protection against overloads, making it a safe and durable choice for power systems.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization and easy mounting, making this FET a practical choice for compact designs.

Terminal Form: GULL WING

The gull wing terminal form offers secure connection and easy soldering, making this FET a reliable choice for electronic circuits.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operating mode ensures fast and efficient switching, making this FET ideal for high-performance applications.

Maximum Pulsed Drain Current (IDM): 640 A

With a high pulsing drain current of 640A, this FET can handle heavy loads with ease, making it a reliable choice for power electronics.

Technical Specifications

Power Field Effect Transistors (FET) STB270N04 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

160 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

640 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB270N04 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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