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STB26NM60ND

STMicroelectronics

STB26NM60ND by STMicroelectronics

STB26NM60ND by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. It features 84A max pulsed drain current and 0.175 ohm max drain-source resistance. Operating in enhancement mode, it has a 190W power dissipation rating and can withstand up to 150°C temperature.

Median Price

$2.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

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$1.060

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-

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1

$1.060

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Arrow

USA . 1 parts In-Stock

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$3.540

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-

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1

$3.540

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Distributors (In-Stock)

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Digiode

USA . 4,843 parts In-Stock

1+ parts

$0.568

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-

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4,843

$0.568

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Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$0.598

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74

$0.598

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Vyrian

USA . 4,988 parts In-Stock

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4,988

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Anansix

USA . 865 parts In-Stock

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865

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$0.510

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-

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1

$0.510

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Corphita

USA . 4,329 parts In-Stock

1+ parts

$0.538

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4,329

$0.538

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Corohmni

South Africa . 52 parts In-Stock

1+ parts

$0.569

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52

$0.569

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Argo Parts USA

USA . 4,446 parts In-Stock

1+ parts

$0.598

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$0.580

4,446

$0.598

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$0.580

Continental Prestige Electronics

USA . 3,833 parts In-Stock

1+ parts

$0.598

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$0.586

3,833

$0.598

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$0.586

IDEA Electronic Components Group

UK . 2,178 parts In-Stock

1+ parts

$0.718

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$0.646

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2,178

$0.718

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$0.646

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Aztec Data Supply Inc.

USA . 4,032 parts In-Stock

1+ parts

$0.990

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4,032

$0.990

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Semicontronic

India . 1 parts In-Stock

1+ parts

$1.110

100+ parts

$1.082

1k+ parts

$1.077

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1

$1.110

$1.082

$1.077

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MKK Technologies

India . 1,957 parts In-Stock

1+ parts

$1.349

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1,957

$1.349

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DigiPath Technology Company

USA . 1,957 parts In-Stock

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$1.349

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1,957

$1.349

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AZTECH Wire

Italy . 795 parts In-Stock

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$13.878

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795

$13.878

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Parana Technologies

USA . 627 parts In-Stock

1+ parts

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$0.858

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627

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$0.858

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$0.586

1k+ parts

$0.568

10k+ parts

$0.556

500

-

$0.586

$0.568

$0.556

Overview

Unleash the power of innovation with the STB26NM60ND by STMicroelectronics. Crafted with precision and excellence, this N-CHANNEL Power Field Effect Transistor offers unmatched performance for switching applications. With a high DS Breakdown Voltage of 600V and a maximum Drain Current of 21A, this transistor is designed to handle even the most demanding tasks with ease. Say goodbye to overheating and inefficiency thanks to its maximum Power Dissipation of 190W and low On Resistance of 0.175 ohm. Whether you're powering up industrial machinery or enhancing electronic devices, the STB26NM60ND delivers reliability and efficiency like never before. Elevate your projects with the superior quality and advanced technology of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from reverse voltage spikes, improving the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for high-speed switching applications, ensuring efficient performance.

Surface Mount: YES

Enables easy and convenient integration onto circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage levels, making it suitable for industrial and high-power applications.

Maximum Power Dissipation (Abs): 190 W

Allows for high power handling capability, making it suitable for demanding situations where power dissipation is critical.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance, ensuring reliability in various conditions.

Technical Specifications

Power Field Effect Transistors (FET) STB26NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB26NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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