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STA8088FGBTR

STMicroelectronics

STA8088FGBTR by STMicroelectronics

STA8088FGBTR by STMicroelectronics is a consumer IC with 56 terminals, operating from -40 to 85 °C. It features power supplies of 1.2V, 1.8/3.3V and CMOS technology. This chip carrier package is surface mountable and suitable for industrial applications requiring a compact square form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,155 parts In-Stock

1+ parts

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4,155

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Anansix

USA . 2,595 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,595

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Vyrian

USA . 2,205 parts In-Stock

1+ parts

-

100+ parts

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2,205

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 806 parts In-Stock

1+ parts

$2.215

100+ parts

-

1k+ parts

$1.994

10k+ parts

-

806

$2.215

-

$1.994

-

MKK Technologies

India . 44 parts In-Stock

1+ parts

$4.166

100+ parts

-

1k+ parts

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10k+ parts

-

44

$4.166

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DigiPath Technology Company

USA . 44 parts In-Stock

1+ parts

$4.166

100+ parts

-

1k+ parts

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10k+ parts

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44

$4.166

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-

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Corphita

USA . 1,527 parts In-Stock

1+ parts

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1,527

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Parana Technologies

USA . 731 parts In-Stock

1+ parts

-

100+ parts

$2.649

1k+ parts

-

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731

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$2.649

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Overview

Unlock endless possibilities with the STA8088FGBTR by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge solutions for consumer electronics applications. The STA8088FGBTR offers unparalleled value with its advanced features and performance, making it the perfect choice for your next project. Experience the benefits of this innovative product and take your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

Being surface mountable allows for easy integration into PCB designs, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it ideal for applications where space is limited.

Power Supplies (V): 1.2,1.8/3.3

Support for multiple power supply voltages (1.2V, 1.8V, 3.3V) enhances compatibility with different systems and requirements.

No. of Terminals: 56

The high number of terminals enables connectivity to various components and peripherals, allowing for versatile functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides robust protection for the integrated circuit within, ensuring reliable performance in demanding environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand elevated temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in cold environments, increasing the product's versatility.

Terminal Position: QUAD

The quad terminal position facilitates easy connection to external circuitry, enhancing the product's usability and flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is suitable for harsh operating conditions and long-term reliability.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, contributing to efficient operation and signal integrity.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and enhances reliability by reducing the risk of solder joint failures.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for high-density mounting, enabling the product to be used in compact electronic devices.

Technical Specifications

Other Function Consumer ICs STA8088FGBTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

STA8088FGBTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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