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STA8088EXGA

STMicroelectronics

STA8088EXGA by STMicroelectronics

STA8088EXGA by STMicroelectronics is a consumer IC with 169 terminals in a grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It utilizes CMOS technology and supports power supplies of 1.2V, 1.8V, and 3.3V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,565 parts In-Stock

1+ parts

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5,565

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Digiode

USA . 2,289 parts In-Stock

1+ parts

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-

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2,289

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Anansix

USA . 836 parts In-Stock

1+ parts

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836

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,425 parts In-Stock

1+ parts

$2.782

100+ parts

-

1k+ parts

$2.504

10k+ parts

-

1,425

$2.782

-

$2.504

-

MKK Technologies

India . 1,074 parts In-Stock

1+ parts

$5.232

100+ parts

-

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-

10k+ parts

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1,074

$5.232

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DigiPath Technology Company

USA . 1,074 parts In-Stock

1+ parts

$5.232

100+ parts

-

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10k+ parts

-

1,074

$5.232

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-

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AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$17.030

100+ parts

-

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217

$17.030

-

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Component Stockers USA

USA . 350 parts In-Stock

1+ parts

$101.570

100+ parts

-

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350

$101.570

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Corphita

USA . 3,877 parts In-Stock

1+ parts

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3,877

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Parana Technologies

USA . 1,821 parts In-Stock

1+ parts

-

100+ parts

$3.326

1k+ parts

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1,821

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$3.326

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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A-Z Elektronik GmbH

Germany . 815 parts In-Stock

1+ parts

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815

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Overview

Discover the STA8088EXGA by STMicroelectronics, a cutting-edge consumer circuit that promises reliability and performance. With a package style of grid array and fine pitch, this industrial-grade IC boasts a wide operating temperature range from -40 °C to 85°C. Suitable for various applications, this versatile IC offers power supplies of 1.2V and 1.8/3.3V, making it an ideal choice for your electronic projects. Experience the quality and innovation that STMicroelectronics brings to the table with the STA8088EXGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the ICs lightweight and cost-effective.

Surface Mount: YES

This feature allows for easy and efficient mounting on PCBs, making the product suitable for automated assembly processes.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving valuable space on the PCB.

Power Supplies (V): 1.2, 1.8/3.3

The wide range of power supply options allows for versatile applications in various electronic devices.

No. of Terminals: 169

The high number of terminals enables complex circuit designs and connections.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style offer high connection density, resulting in increased functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the ICs to operate effectively in a wide range of temperature conditions.

Terminal Position: BOTTOM

The terminals positioned at the bottom facilitate easy and secure soldering to the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes the ICs suitable for operation in harsh industrial environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the ICs.

Terminal Form: BALL

The ball terminal form ensures reliable and secure connections, reducing the risk of signal loss or interference.

Terminal Pitch: 0.635 mm

The small terminal pitch enables high-density mounting of components, contributing to compact and space-efficient PCB designs.

Technical Specifications

Other Function Consumer ICs STA8088EXGA attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B169

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Trade Compliance

STA8088EXGA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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