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STA8088F

STMicroelectronics

STA8088F by STMicroelectronics

STA8088F by STMicroelectronics is a consumer IC with 56 terminals, operating from -40 to 85 °C. It has power supplies of 1.2V, 1.8/3.3V and uses CMOS technology. This chip carrier package is surface mountable and suitable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,700 parts In-Stock

1+ parts

-

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1k+ parts

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4,700

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-

-

-

Digiode

USA . 2,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,887

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-

-

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Vyrian

USA . 2,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,580

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-

-

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Anansix

USA . 2,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,310

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,643 parts In-Stock

1+ parts

$0.501

100+ parts

-

1k+ parts

$0.451

10k+ parts

-

1,643

$0.501

-

$0.451

-

MKK Technologies

India . 295 parts In-Stock

1+ parts

$0.943

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$0.943

-

-

-

DigiPath Technology Company

USA . 295 parts In-Stock

1+ parts

$0.943

100+ parts

-

1k+ parts

-

10k+ parts

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295

$0.943

-

-

-

AZTECH Wire

Italy . 739 parts In-Stock

1+ parts

$21.220

100+ parts

-

1k+ parts

-

10k+ parts

-

739

$21.220

-

-

-

Component Stockers USA

USA . 669 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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669

$99.990

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-

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Corphita

USA . 1,549 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,549

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Parana Technologies

USA . 397 parts In-Stock

1+ parts

-

100+ parts

$0.600

1k+ parts

-

10k+ parts

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397

-

$0.600

-

-

Overview

Elevate your consumer electronics with the STA8088F from STMicroelectronics. This cutting-edge IC boasts superior quality and reliability from a trusted manufacturer, offering a wide range of applications in various industries. With its advanced technology and industrial-grade temperature tolerance, this chip carrier package delivers unmatched performance and efficiency. Upgrade your products with the STA8088F and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the IC lightweight and durable, suitable for various consumer applications.

Surface Mount: YES

Being surface mountable means easier and more efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: SQUARE

The square package shape provides a compact design and efficient use of space on the PCB.

Power Supplies (V): 1.2,1.8/3.3

Support for multiple power supply voltages allows versatility in different applications and environments.

No. of Terminals: 56

The high number of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers reliable and secure mounting of the IC on the PCB.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can perform reliably in industrial settings with high temperatures.

Minimum Operating Temperature: -40 °C

The IC is designed to operate efficiently even in extremely low temperatures, making it suitable for a wide range of environmental conditions.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections to other components on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can withstand harsh conditions and maintain performance in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable for consumer electronics.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS regulations, reducing the impact on the environment.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density mounting on the PCB, saving space and enabling compact designs.

Technical Specifications

Other Function Consumer ICs STA8088F attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

STA8088F General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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