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STA8088EXGATR

STMicroelectronics

STA8088EXGATR by STMicroelectronics

STA8088EXGATR by STMicroelectronics is a consumer IC with 1.2V power supply, 169 terminals in grid array package. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications requiring CMOS technology and AEC-Q100 screening level.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 1,750 parts In-Stock

1+ parts

-

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1k+ parts

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1,750

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,127 parts In-Stock

1+ parts

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3,127

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Anansix

USA . 1,950 parts In-Stock

1+ parts

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1,950

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Digiode

USA . 1,130 parts In-Stock

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1,130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,026 parts In-Stock

1+ parts

$1.052

100+ parts

-

1k+ parts

$0.946

10k+ parts

-

1,026

$1.052

-

$0.946

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MKK Technologies

India . 1,677 parts In-Stock

1+ parts

$1.977

100+ parts

-

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1,677

$1.977

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DigiPath Technology Company

USA . 1,677 parts In-Stock

1+ parts

$1.977

100+ parts

-

1k+ parts

-

10k+ parts

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1,677

$1.977

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-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$4.685

100+ parts

$4.263

1k+ parts

$3.842

10k+ parts

-

2,500

$4.685

$4.263

$3.842

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AZTECH Wire

Italy . 1,091 parts In-Stock

1+ parts

$18.990

100+ parts

-

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1,091

$18.990

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Corphita

USA . 1,628 parts In-Stock

1+ parts

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1,628

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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-

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Parana Technologies

USA . 891 parts In-Stock

1+ parts

-

100+ parts

$1.257

1k+ parts

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10k+ parts

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891

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$1.257

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-

Overview

Unleash the power of innovation with the STA8088EXGATR by STMicroelectronics. This cutting-edge consumer IC offers unrivaled quality and reliability, thanks to its manufacturer's reputation for excellence. Whether you're in automotive, industrial, or consumer electronics, this versatile product is designed to meet your needs with precision and efficiency. Experience the value and benefits it brings to your projects, from its advanced technology to its wide operating temperature range. Embrace the future of electronics with the STA8088EXGATR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and automated assembly processes.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality for automotive applications.

Package Shape: SQUARE

Square package shape enables efficient use of PCB space and allows for neat layout designs.

Power Supplies (V): 1.2

Operates at low power supply voltage, suitable for portable consumer devices.

No. of Terminals: 169

With a large number of terminals, this IC can connect to various components for versatile functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style offers high density integration and reliable connections.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures makes it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable performance in extreme environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and improves heat dissipation.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range, ensuring robust performance in harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides secure connections and ease of soldering during assembly.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density packaging and space-saving on the PCB.

Technical Specifications

Other Function Consumer ICs STA8088EXGATR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B169

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Trade Compliance

STA8088EXGATR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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