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STA8088EXG

STMicroelectronics

STA8088EXG by STMicroelectronics

STA8088EXG by STMicroelectronics is a consumer IC with 169 terminals in a grid array package. Operating at -40 to 85 °C, it uses CMOS technology and has power supplies of 1.2V, 1.8/3.3V for industrial applications requiring fine pitch terminal style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,293 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,293

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-

-

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Digiode

USA . 2,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,277

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-

-

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Anansix

USA . 789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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789

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,087 parts In-Stock

1+ parts

$2.278

100+ parts

-

1k+ parts

$2.050

10k+ parts

-

1,087

$2.278

-

$2.050

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$3.657

100+ parts

$3.328

1k+ parts

$2.999

10k+ parts

-

450

$3.657

$3.328

$2.999

-

MKK Technologies

India . 1,388 parts In-Stock

1+ parts

$4.283

100+ parts

-

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-

10k+ parts

-

1,388

$4.283

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-

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DigiPath Technology Company

USA . 1,388 parts In-Stock

1+ parts

$4.283

100+ parts

-

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-

10k+ parts

-

1,388

$4.283

-

-

-

AZTECH Wire

Italy . 102 parts In-Stock

1+ parts

$20.340

100+ parts

-

1k+ parts

-

10k+ parts

-

102

$20.340

-

-

-

Corphita

USA . 4,264 parts In-Stock

1+ parts

-

100+ parts

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4,264

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-

-

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Parana Technologies

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

$2.724

1k+ parts

-

10k+ parts

-

2,174

-

$2.724

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,000

-

-

-

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RC Electronics

USA . 560 parts In-Stock

1+ parts

-

100+ parts

$30.200

1k+ parts

$27.410

10k+ parts

$26.440

560

-

$30.200

$27.410

$26.440

Futuretech Components

Singapore . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

-

-

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Kepictronics

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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100

-

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-

Overview

Unlock next-level performance with the STA8088EXG by STMicroelectronics. Crafted with precision and expertise, this cutting-edge consumer circuit IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this innovative product delivers exceptional value and benefits to customers looking for top-notch performance. Experience seamless operation and superior efficiency with the STA8088EXG, setting new standards in the industry. Elevate your projects with the ultimate solution from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and durable, making it suitable for consumer applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into PCBs, saving space and facilitating automated assembly processes.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, this IC is optimized for efficiency, reliability, and cost-effectiveness in consumer electronic devices.

Power Supplies (V): 1.2,1.8/3.3

Supporting multiple power supply voltages, this IC offers flexibility in design and compatibility with various consumer electronic devices.

No. of Terminals: 169

With a high number of terminals, this IC can accommodate a wide range of connections and functions in complex consumer circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this IC to withstand demanding conditions in industrial environments without sacrificing performance.

Technology: CMOS

Utilizing CMOS technology, this IC offers low power consumption, high noise immunity, and compatibility with a wide range of consumer devices.

Technical Specifications

Other Function Consumer ICs STA8088EXG attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STA8088EXG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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