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STA8088FBTR

STMicroelectronics

STA8088FBTR by STMicroelectronics

STA8088FBTR by STMicroelectronics is a consumer IC with 56 terminals, operating from -40 to 85 °C. It has power supplies of 1.2V, 1.8/3.3V and uses CMOS technology. This chip carrier package is surface mountable and suitable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,775 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,775

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Anansix

USA . 1,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,787

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-

-

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Digiode

USA . 1,616 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,616

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 998 parts In-Stock

1+ parts

$1.948

100+ parts

-

1k+ parts

$1.753

10k+ parts

-

998

$1.948

-

$1.753

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MKK Technologies

India . 1,958 parts In-Stock

1+ parts

$3.662

100+ parts

-

1k+ parts

-

10k+ parts

-

1,958

$3.662

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-

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DigiPath Technology Company

USA . 1,958 parts In-Stock

1+ parts

$3.662

100+ parts

-

1k+ parts

-

10k+ parts

-

1,958

$3.662

-

-

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Corphita

USA . 2,717 parts In-Stock

1+ parts

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2,717

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-

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Parana Technologies

USA . 531 parts In-Stock

1+ parts

-

100+ parts

$2.329

1k+ parts

-

10k+ parts

-

531

-

$2.329

-

-

Overview

Unlock the power of cutting-edge technology with the STA8088FBTR by STMicroelectronics. Designed with precision and expertise, this consumer IC offers unparalleled performance and reliability. From automotive to industrial applications, this versatile chip carrier is sure to meet your needs. With a wide range of power supplies and industrial-grade temperature specifications, this product provides exceptional value and efficiency. Trust in STMicroelectronics to deliver top-of-the-line solutions for all your electronic requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape helps in efficient utilization of board space and allows for easy placement on PCBs.

Power Supplies (V): 1.2,1.8/3.3

Support for multiple power supply voltages makes this product versatile and compatible with a wide range of applications.

No. of Terminals: 56

The high number of terminals offers greater connectivity options and flexibility in designing circuit connections.

Package Style: CHIP CARRIER

The chip carrier package style provides enhanced thermal performance and protection, making the product suitable for industrial use.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the product to operate in extreme cold environments without performance degradation.

Terminal Position: QUAD

The quad terminal position facilitates easy installation and connection, improving overall efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability under demanding operating conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failure, enhancing the product's reliability and longevity.

Terminal Pitch: 0.4 mm

The tight terminal pitch allows for high-density PCB designs and enables compact circuit layouts.

Technical Specifications

Other Function Consumer ICs STA8088FBTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

STA8088FBTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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