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STA8088EXGTR

STMicroelectronics

STA8088EXGTR by STMicroelectronics

STA8088EXGTR by STMicroelectronics is a consumer IC with 169 terminals, operating from -40 to 85 °C. It features a power supply of 1.2V and CMOS technology, suitable for industrial applications requiring AEC-Q100 screening. The package is a grid array with fine pitch in plastic/epoxy material for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,139 parts In-Stock

1+ parts

-

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8,139

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Digiode

USA . 4,646 parts In-Stock

1+ parts

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4,646

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Anansix

USA . 254 parts In-Stock

1+ parts

-

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254

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$2.955

100+ parts

-

1k+ parts

$2.660

10k+ parts

-

692

$2.955

-

$2.660

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MKK Technologies

India . 2,347 parts In-Stock

1+ parts

$5.557

100+ parts

-

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2,347

$5.557

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DigiPath Technology Company

USA . 2,347 parts In-Stock

1+ parts

$5.557

100+ parts

-

1k+ parts

-

10k+ parts

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2,347

$5.557

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AZTECH Wire

Italy . 1,044 parts In-Stock

1+ parts

$20.200

100+ parts

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1,044

$20.200

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Parana Technologies

USA . 2,366 parts In-Stock

1+ parts

-

100+ parts

$3.533

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2,366

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$3.533

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Corphita

USA . 1,894 parts In-Stock

1+ parts

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1,894

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Overview

Unlock the potential of your electronic devices with the STA8088EXGTR by STMicroelectronics. Designed with precision and reliability in mind, this consumer circuit IC offers unparalleled performance and efficiency. Whether you're looking to enhance the functionality of your smart home devices or streamline your automotive systems, this product is the perfect solution. Experience the seamless integration and cutting-edge technology that STMicroelectronics is renowned for, and take your projects to the next level with the STA8088EXGTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing the overall weight of the product while also providing durability and protection for the internal components.

Surface Mount: YES

Surface mount capability makes the product easier to integrate into electronic circuits and reduces the need for manual soldering, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and performance of the product, making it suitable for automotive applications where quality and durability are crucial.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards, making it easier to place and route connections for optimized performance.

Power Supplies (V): 1.2

Operating at a low voltage of 1.2V helps in reducing power consumption and heat generation, resulting in energy efficiency and improved overall performance.

No. of Terminals: 169

Having 169 terminals allows for a high degree of connectivity and functionality, enabling the product to support a wide range of applications and features.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design provides a compact and efficient packaging solution, allowing for high terminal density and improved signal integrity.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability and stability of the product under various environmental conditions, making it suitable for industrial settings.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C allows the product to function in harsh and extreme cold environments without compromising performance or durability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and connection of the product on circuit boards, simplifying the assembly process and ensuring proper functioning of the device.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates that the product is designed to withstand rugged conditions and temperature extremes, making it suitable for robust industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, making the product efficient and effective for various consumer electronic applications.

Terminal Form: BALL

Using ball terminals provides a secure and reliable connection, minimizing the risk of signal loss or interference and ensuring consistent performance of the product.

Terminal Pitch: 0.635 mm

Having a terminal pitch of 0.635 mm allows for precise and compact placement of terminals, enabling high-density integration and efficient use of space on circuit boards.

Technical Specifications

Other Function Consumer ICs STA8088EXGTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B169

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

BOTTOM

Trade Compliance

STA8088EXGTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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