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STA8088A5

STMicroelectronics

STA8088A5 by STMicroelectronics

STA8088A5 by STMicroelectronics is a consumer IC with 56 terminals in a chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It features CMOS technology, 1.2V power supply, and AEC-Q100 screening level for automotive use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,819 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,819

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Vyrian

USA . 842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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842

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Anansix

USA . 407 parts In-Stock

1+ parts

-

100+ parts

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407

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,864 parts In-Stock

1+ parts

$2.506

100+ parts

-

1k+ parts

$2.255

10k+ parts

-

1,864

$2.506

-

$2.255

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MKK Technologies

India . 1,706 parts In-Stock

1+ parts

$4.713

100+ parts

-

1k+ parts

-

10k+ parts

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1,706

$4.713

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-

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DigiPath Technology Company

USA . 1,706 parts In-Stock

1+ parts

$4.713

100+ parts

-

1k+ parts

-

10k+ parts

-

1,706

$4.713

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-

-

Corphita

USA . 3,660 parts In-Stock

1+ parts

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1k+ parts

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3,660

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Parana Technologies

USA . 2,020 parts In-Stock

1+ parts

-

100+ parts

$2.996

1k+ parts

-

10k+ parts

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2,020

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$2.996

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Overview

Experience top-notch performance and reliability with the STA8088A5 from STMicroelectronics, a leading manufacturer in the industry. This cutting-edge consumer IC offers unparalleled value and benefits for a wide range of applications. Whether you're looking for high-quality power supplies or temperature-grade technology, this chip carrier package is designed to exceed your expectations. Trust in STMicroelectronics to deliver exceptional products that cater to your industrial needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the IC durable and resistant to external elements, ensuring longevity and reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, making it suitable for high-volume production and compact designs.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets automotive industry standards, making it suitable for automotive applications requiring high reliability and performance.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it ideal for space-constrained applications and enabling efficient use of PCB real estate.

Power Supplies (V): 1.2

The 1.2V power supply allows for low power consumption, making it energy-efficient and suitable for battery-operated devices.

No. of Terminals: 56

The 56 terminals offer a high level of connectivity and functionality, making the IC versatile and capable of handling complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides good thermal performance and ease of heat dissipation, ensuring the IC operates within safe temperature limits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the IC to withstand harsh environmental conditions, making it reliable and suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the IC can function in extreme cold environments, making it versatile and suitable for a wide range of applications.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, minimizing the risk of signal loss or malfunction, ensuring reliable performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can operate in demanding industrial environments with temperature fluctuations, making it robust and dependable.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable for various digital applications.

Terminal Form: NO LEAD

The no-lead terminal form provides a cleaner and more environmentally friendly assembly process, reducing the risk of lead contamination and meeting modern regulatory standards.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density mounting and efficient use of board space, making the IC suitable for compact and miniaturized designs.

Technical Specifications

Other Function Consumer ICs STA8088A5 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.2

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STA8088A5 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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