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STA8088FTR

STMicroelectronics

STA8088FTR by STMicroelectronics

STA8088FTR by STMicroelectronics is a consumer IC with 56 terminals, operating at -40 to 85 °C. It features power supplies of 1.2V, 1.8/3.3V and CMOS technology. This chip carrier package is surface mountable and suitable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 97,908 parts In-Stock

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97,908

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Vyrian

USA . 2,508 parts In-Stock

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2,508

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Anansix

USA . 980 parts In-Stock

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980

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Digiode

USA . 844 parts In-Stock

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844

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$2.246

100+ parts

-

1k+ parts

$2.021

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1,245

$2.246

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$2.021

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MKK Technologies

India . 1,026 parts In-Stock

1+ parts

$4.223

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1,026

$4.223

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DigiPath Technology Company

USA . 1,026 parts In-Stock

1+ parts

$4.223

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1,026

$4.223

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$13.280

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597

$13.280

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Corphita

USA . 4,856 parts In-Stock

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4,856

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Component Stockers USA

USA . 3,677 parts In-Stock

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3,677

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Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

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$2.685

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1,542

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$2.685

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Upgrade your consumer electronics with the STA8088FTR by STMicroelectronics, a high-quality consumer circuit designed to enhance performance and functionality. With STMicroelectronics' reputation for reliability and innovation, you can trust that this IC will deliver superior results in a wide range of applications. From smart home devices to wearable technology, the STA8088FTR offers unmatched value, benefits, and advantages to customers looking to stay ahead in the rapidly evolving tech landscape. Experience the difference with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on printed circuit boards, saving space and enabling automated assembly processes.

Package Shape: SQUARE

Square package shape provides a compact and uniform form factor, making the IC easy to handle and integrate into electronic devices.

Power Supplies (V): 1.2,1.8/3.3

Supporting multiple power supply voltages gives flexibility in design and compatibility with various systems and components.

No. of Terminals: 56

Having a high number of terminals allows for connectivity to multiple external components and peripherals, enhancing the functionality of the IC.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer protection to the IC and facilitate easy handling during manufacturing and integration processes.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and stable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance enables the IC to operate efficiently even in cold environments, increasing its versatility.

Terminal Position: QUAD

Quad terminal position layout enables easy connection to other components, improving the overall efficiency of the circuit design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures robustness and reliability for use in demanding industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in various applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and ensures compliance with environmental regulations, making it an eco-friendly choice.

Terminal Pitch: 0.4 mm

Having a small terminal pitch allows for high-density mounting of components, enabling compact designs and space-saving solutions.

Technical Specifications

Other Function Consumer ICs STA8088FTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

STA8088FTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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