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STA533WF13TR

STMicroelectronics

STA533WF13TR by STMicroelectronics

STA533WF13TR by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 18V and supports up to 4 functions. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for applications requiring efficient power management in compact designs, it operates b/w 0 °C to 70 °C.

Median Price

$1.413

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 901 parts In-Stock

1+ parts

$2.750

100+ parts

$2.030

1k+ parts

$1.420

10k+ parts

$1.280

901

$2.750

$2.030

$1.420

$1.280

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

1,000

-

$1.360

$1.130

$1.010

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

$1.262

1,000

-

-

$1.413

$1.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,370 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

2,370

$1.320

-

-

-

Vyrian

USA . 6,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,080

-

-

-

-

Anansix

USA . 1,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,048 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

-

10k+ parts

-

3,048

$1.251

-

-

-

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$1.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$1.310

-

-

-

Component Stockers USA

USA . 2,733 parts In-Stock

1+ parts

$1.360

100+ parts

$1.290

1k+ parts

$1.250

10k+ parts

-

2,733

$1.360

$1.290

$1.250

-

IDEA Electronic Components Group

UK . 1,968 parts In-Stock

1+ parts

$3.623

100+ parts

-

1k+ parts

$3.261

10k+ parts

-

1,968

$3.623

-

$3.261

-

MKK Technologies

India . 1,830 parts In-Stock

1+ parts

$6.813

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

$6.813

-

-

-

DigiPath Technology Company

USA . 1,830 parts In-Stock

1+ parts

$6.813

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

$6.813

-

-

-

Microchip USA

USA . 3,290 parts In-Stock

1+ parts

$10.561

100+ parts

-

1k+ parts

-

10k+ parts

-

3,290

$10.561

-

-

-

Perfect Parts

USA . 30,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,124

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,484

-

-

-

-

GreenTree Electronics

Israel . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Kepictronics

USA . 5,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,185

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,900

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,477

-

-

-

-

Parana Technologies

USA . 2,202 parts In-Stock

1+ parts

-

100+ parts

$4.332

1k+ parts

-

10k+ parts

-

2,202

-

$4.332

-

-

Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

-

-

-

-

Infinite Electronics LLP (Excess)

. 505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

505

-

-

-

-

Overview

Elevate your projects with the STA533WF13TR from STMicroelectronics—a leader in high-performance semiconductor solutions. This versatile peripheral driver offers unparalleled quality and reliability, featuring built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for applications ranging from motor control to automation systems, it ensures optimal performance while simplifying design challenges. Experience the benefits of robust engineering and innovation that drive success in your next endeavor!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good resistance to environmental factors, ensuring durability and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact circuit design, making it suitable for modern electronics with space constraints.

Maximum Supply Voltage: 18 V

The higher maximum supply voltage extends the range of applications for this peripheral driver, accommodating various power requirements.

No. of Functions: 4

With four functions, this product offers versatility, allowing it to control multiple devices or functions in one compact solution.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, facilitating efficient layout and component placement.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

These protective features enhance device safety and reliability, reducing the risk of failure in demanding environments.

No. of Terminals: 36

The inclusion of multiple terminals increases flexibility for connectivity and integration with various systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style aids in better thermal management and allows for efficient soldering processes in manufacturing.

Minimum Supply Voltage: 5 V

The low minimum supply voltage allows operation in low-power applications, making it energy-efficient.

Maximum Operating Temperature: 70 °C

This ensures reliable performance in a wide range of operating conditions, suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The capability to operate from zero°C ensures functionality in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

This finish provides good solderability and resistance to oxidation, ensuring reliable electrical connections.

Terminal Position: DUAL

The dual terminal position allows for flexible design choices during installation and integration into systems.

Maximum Seated Height: 2.47 mm

A low profile aids in compact design, allowing for thinner devices and better integration into space-constrained environments.

Width: 7.5 mm

This width offers compatibility with a variety of circuit board layouts while ensuring adequate performance.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the device can withstand manufacturing processes that involve high temperatures without damage.

Peak Reflow Temperature °C: 260

The high reflow temperature tolerance makes this IC suitable for modern assembly techniques in electronics manufacturing.

Length: 10.3 mm

The compact length allows flexibility in layout design, fitting efficiently into various electronic assemblies.

Temperature Grade: COMMERCIAL

This classification ensures the product is designed for broad commercial applications with stability and reliability.

Technology: BCD

BCD technology offers efficiency and integration benefits, leading to lower power consumption and enhanced performance.

Terminal Form: GULL WING

The gull wing terminal design facilitates easy surface mounting and reliable solder joints.

Turn-on Time: 0.06 us

Fast turn-on time ensures quick response in applications requiring rapid switching, enhancing overall system performance.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables denser component placement on PCBs, maximizing space utilization.

Moisture Sensitivity Level (MSL): 3

This level indicates that the product can withstand moderate moisture exposure during processing, ensuring reliability.

Nominal Output Peak Current Limit: 4 A

The ability to handle higher peak currents makes this driver suitable for driving demanding loads effectively.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Designed specifically for peripheral control, this type offers excellent performance in a wide range of motor and load driving applications.

Turn-off Time: 0.06 us

A fast turn-off time contributes to better control and efficiency in switching applications.

Output Current Flow Direction: SOURCE AND SINK

This dual current flow capability provides enhanced versatility for controlling multiple types of loads.

Technical Specifications

Peripheral Drivers STA533WF13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.47 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.06 us

Turn-on Time:

.06 us

Width:

7.5 mm

Trade Compliance

STA533WF13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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