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ST10R172LT6

STMicroelectronics

ST10R172LT6 by STMicroelectronics

ST10R172LT6 by STMicroelectronics is a 16-bit microcontroller with 24-bit address bus width, operating at up to 100 MHz. Ideal for industrial applications, it features a max supply voltage of 3.6V and offers 1024 bytes of RAM for efficient processing. With a compact square package style and low profile design, this microcontroller is suitable for various embedded systems requiring high-speed performance in a small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,641 parts In-Stock

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2,641

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Anansix

USA . 1,500 parts In-Stock

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1,500

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Digiode

USA . 1,369 parts In-Stock

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1,369

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Q Components

USA . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 497 parts In-Stock

1+ parts

$10.413

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497

$10.413

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AZTECH Wire

Italy . 53 parts In-Stock

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$17.940

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53

$17.940

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IDEA Electronic Components Group

UK . 2,011 parts In-Stock

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$56.307

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$50.676

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2,011

$56.307

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$50.676

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MKK Technologies

India . 1,143 parts In-Stock

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$105.881

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1,143

$105.881

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DigiPath Technology Company

USA . 1,143 parts In-Stock

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$105.881

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1,143

$105.881

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Kepictronics

USA . 4,350 parts In-Stock

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4,350

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Corphita

USA . 1,775 parts In-Stock

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1,775

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Perfect Parts

USA . 1,589 parts In-Stock

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1,589

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Parana Technologies

USA . 1,435 parts In-Stock

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$67.323

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1,435

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$67.323

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Overview

Elevate your projects with the ST10R172LT6 microcontroller by STMicroelectronics. With a reputation for high-quality manufacturing, STMicroelectronics delivers exceptional performance and reliability in their products. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers seeking advanced technology solutions. Experience the advantages of seamless integration and innovative features that this product brings to your designs. Unlock endless possibilities with the ST10R172LT6 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design in electronic circuits.

Maximum Supply Voltage: 3.6 V

Provides a higher supply voltage range for flexibility in power management.

Address Bus Width: 24

A wide address bus width allows for larger memory addressing capability for complex applications.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and space utilization.

Bit Size: 16

16-bit architecture enables faster processing and data manipulation compared to lower bit sizes.

Power Supplies (V): 3.3

The power supply voltage of 3.3V is common and widely supported in electronic systems.

No. of Terminals: 100

Having a sufficient number of terminals allows for connecting to various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact size, low profile, and fine pitch for high-density integration.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, the product can operate in a wide voltage range for reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance in industrial environments.

CPU Family: ST10

Part of the ST10 CPU family known for high performance and efficiency in microcontroller applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C makes the product suitable for harsh and cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity for reliable terminal connections.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and secure mounting on PCBs.

Maximum Seated Height: 1.6 mm

Low seated height enables slim and compact designs for space-constrained applications.

Width: 14 mm

Compact width size facilitates PCB layout and integration in small electronic devices.

External Data Bus Width: 16

16-bit external data bus width supports high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 100 MHz

High maximum clock frequency of 100 MHz allows for faster processing and real-time operation.

Length: 14 mm

Short length size is ideal for compact electronic applications and space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in challenging environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller with integrated peripherals for efficient control and processing functions.

RAM Bytes: 1024

Ample RAM size of 1024 bytes for data storage and manipulation in complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for energy-efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering for reliable connections.

Maximum Supply Current: 140 mA

With a maximum supply current of 140 mA, the product operates within power efficiency limits.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of signals for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density terminal placement and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard handling and storage protocols.

Speed: 50 rpm

Offers moderate processing speed of 50 rpm for versatile control and computational tasks.

No. of I/O Lines: 77

Plenty of I/O lines (77) for interfacing with various external devices and sensors in embedded applications.

Technical Specifications

Microcontrollers ST10R172LT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

100 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST10R172LT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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