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ST10R172LT1

STMicroelectronics

ST10R172LT1 by STMicroelectronics

ST10R172LT1 microcontroller from STMicroelectronics features a 16-bit architecture, operates at a max voltage of 3.6V, and supports up to 100 MHz clock frequency. With 1024 bytes of RAM and 77 I/O lines, it's ideal for embedded applications requiring efficient processing. Its compact design ensures versatility in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,170 parts In-Stock

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3,170

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Digiode

USA . 2,947 parts In-Stock

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2,947

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Anansix

USA . 2,426 parts In-Stock

1+ parts

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2,426

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Sensible Micro Corp

USA . 20 parts In-Stock

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-

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20

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ComSIT Distribution GmbH

Germany . 17 parts In-Stock

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17

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Semi Source

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 127 parts In-Stock

1+ parts

$18.250

100+ parts

-

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127

$18.250

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AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$19.640

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282

$19.640

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$21.559

100+ parts

$21.343

1k+ parts

$20.481

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-

3,000

$21.559

$21.343

$20.481

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IDEA Electronic Components Group

UK . 389 parts In-Stock

1+ parts

$33.302

100+ parts

-

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$29.972

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389

$33.302

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$29.972

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MKK Technologies

India . 2,127 parts In-Stock

1+ parts

$62.623

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2,127

$62.623

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DigiPath Technology Company

USA . 2,127 parts In-Stock

1+ parts

$62.623

100+ parts

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2,127

$62.623

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A-Z Elektronik GmbH

Germany . 4,956 parts In-Stock

1+ parts

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4,956

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Corphita

USA . 4,742 parts In-Stock

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4,742

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Parana Technologies

USA . 1,837 parts In-Stock

1+ parts

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$39.818

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1,837

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$39.818

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Overview

Elevate your projects with the ST10R172LT1 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this powerful 16-bit MCU seamlessly integrates into diverse applications, from automotive systems to industrial automation. Enjoy superior performance, low power consumption, and robust reliability, ensuring your designs are both efficient and durable. Choose STMicroelectronics and empower your creations with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material protects the microcontroller from environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and reduces PCB space, facilitating efficient application in modern electronics.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with a wide array of power sources, offering flexibility in system design.

Address Bus Width: 24

A 24-bit address bus enables efficient memory addressing, allowing for effective management of more extensive data sets.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution and simplifies PCB layout, making it user-friendly for developers.

Bit Size: 16

With a 16-bit architecture, this microcontroller balances computational performance with low power consumption for efficient operation.

Power Supplies (V): 3.3

Operating at 3.3V means lower power consumption, making it an energy-efficient choice for battery-operated devices.

No. of Terminals: 100

A total of 100 terminals provide extensive connectivity options for peripherals and sensors, enhancing interactivity in designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style contributes to a low-profile design that is ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

This minimum voltage criterion ensures reliable performance across various operating conditions and helps prolong battery life.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C makes it suitable for commercial applications, providing durability in demanding environments.

CPU Family: ST10

The ST10 CPU family is known for its efficiency and performance in handling complex tasks, making it a robust choice for advanced applications.

Minimum Operating Temperature: 0 °C

This low temperature threshold ensures reliable operation in various environmental conditions, broadening application usability.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and ensures reliable electrical connections, enhancing long-term durability.

Terminal Position: QUAD

Quad terminal positioning maximizes connectivity options while simplifying PCB layout design.

Maximum Seated Height: 1.6 mm

A compact seated height contributes to space optimization in PCB designs, making it suitable for miniaturized applications.

Width: 14 mm

A 14 mm width allows for design flexibility and compatibility with many existing PCB layouts.

External Data Bus Width: 16

A 16-bit data bus width ensures efficient data transfer rates, contributing to improved overall system performance.

Maximum Clock Frequency: 100 MHz

Operating at a maximum clock frequency of 100 MHz provides high processing speeds which enhance the performance for complex applications.

Length: 14 mm

The compact length enables space-saving designs, essential for modern electronics that require small form factors.

Temperature Grade: COMMERCIAL

Commercial temperature grades ensure reliable performance in standard operational environments, ideal for consumer applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it serves a wide range of functionalities in embedded systems, making it versatile for various applications.

RAM Bytes: 1024

With 1024 bytes of RAM, this microcontroller can effectively handle basic processing tasks and support moderately complex applications.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, making this microcontroller ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve reliability in mounting, enhancing overall assembly efficiency.

Maximum Supply Current: 140 mA

A maximum supply current of 140 mA indicates moderate power consumption, suitable for low to medium power applications.

Nominal Supply Voltage: 3.3 V

Maintaining a nominal supply voltage of 3.3V ensures stable operations while minimizing power draw, ideal for energy-efficient designs.

PWM Channels: YES

The availability of PWM channels allows for sophisticated control of motors and LEDs, expanding the product’s applicability in automation.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for higher density interconnection on PCBs, ideal for compact circuitry.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that special handling is required, helping manufacturers to ensure long-term reliability in humid conditions.

Speed: 50 rpm

This specification may relate to motors driven by the microcontroller, showcasing its capacity for controlling mechanical motion effectively.

No. of I/O Lines: 77

Having 77 I/O lines maximizes the microcontroller's capability to connect with external devices and sensors, enhancing its flexibility in applications.

Technical Specifications

Microcontrollers ST10R172LT1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

100 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST10R172LT1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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