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ST10F280-Q3TR

STMicroelectronics

ST10F280-Q3TR by STMicroelectronics

ST10F280-Q3TR from STMicroelectronics is a 16-bit automotive microcontroller with a max supply voltage of 5.5V and operates b/w -40 °C to 125°C. It features 143 I/O lines, ADC, and PWM channels for versatile applications. Ideal for automotive systems requiring reliable performance in harsh conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 7,300 parts In-Stock

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7,300

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Vyrian

USA . 6,809 parts In-Stock

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6,809

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Digiode

USA . 3,420 parts In-Stock

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3,420

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Anansix

USA . 1,035 parts In-Stock

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1,035

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Distributors (Availability)

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AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$18.610

100+ parts

-

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563

$18.610

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

1+ parts

$18.614

100+ parts

-

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$16.753

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2,282

$18.614

-

$16.753

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MKK Technologies

India . 1,712 parts In-Stock

1+ parts

$35.003

100+ parts

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1,712

$35.003

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DigiPath Technology Company

USA . 1,712 parts In-Stock

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$35.003

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1,712

$35.003

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Microchip USA

USA . 2,956 parts In-Stock

1+ parts

$38.092

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2,956

$38.092

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Component Stockers USA

USA . 219 parts In-Stock

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$99.990

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219

$99.990

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Authorized Procurement Solutions

USA . 76,950 parts In-Stock

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76,950

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A-Z Elektronik GmbH

Germany . 7,013 parts In-Stock

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7,013

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Corphita

USA . 3,567 parts In-Stock

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3,567

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Parana Technologies

USA . 1,383 parts In-Stock

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$22.256

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1,383

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$22.256

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 320 parts In-Stock

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320

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Overview

Unlock unparalleled performance with the ST10F280-Q3TR microcontroller from STMicroelectronics, a trusted leader in cutting-edge semiconductor solutions. Designed for automotive applications, this robust 16-bit MCU ensures reliability in extreme conditions, delivering superior efficiency and flexibility. Experience seamless integration and enhanced functionality with features like ADC and PWM channels, empowering your innovations while boosting productivity and reducing time-to-market. Elevate your projects with STMicroelectronics’ commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers good durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology ensures a compact design, allowing for high-density circuit layouts, which is ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply systems.

Package Shape: SQUARE

The square package shape facilitates efficient layout and routing on PCBs, aiding in design simplicity.

Bit Size: 16

A 16-bit architecture can handle a moderate level of processing complexity, making it suitable for a variety of control applications.

No. of Terminals: 208

A higher number of terminals allows for extensive peripheral connectivity, enhancing the microcontroller's versatility.

Package Style (Meter): GRID ARRAY

Grid array packaging supports excellent electrical performance and thermal dissipation, benefiting high-frequency applications.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum supply voltage of 4.5 V facilitates use in systems with lower power supply constraints.

Maximum Operating Temperature: 125 °C

Operating at high temperatures makes this microcontroller suitable for automotive and other high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures enhances reliability in challenging conditions and applications.

Terminal Finish: TIN SILVER

The tin-silver finish improves solderability, leading to better reliability in assembly processes.

ADC Channels: YES

Integrated ADC channels allow for efficient data acquisition from analog signals, valuable in sensor applications.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and manufacturing processes, reducing overall production complexities.

Maximum Seated Height: 1.96 mm

A low seated height aids in compact design, making this microcontroller an excellent fit for miniaturized devices.

Width: 23 mm

Width of 23 mm contributes to space-efficient designs while ensuring stability in various mounting configurations.

Maximum Clock Frequency: 80 MHz

An 80 MHz clock frequency enables rapid processing capabilities, making the microcontroller suitable for demanding applications.

Maximum Time At Peak Reflow Temperature: 30 s

Handles peak reflow time effectively, ensuring robust solder joints during manufacturing processes.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature improves component reliability during soldering processes.

Length: 23 mm

Standard length allows for compatibility with common PCB layouts and designs.

Temperature Grade: AUTOMOTIVE

Designed to meet stringent automotive standards ensures reliable performance in vehicle-related applications.

Peripheral IC Type: MICROCONTROLLER

As a type of microcontroller, this product is versatile for controlling devices in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminals provide enhanced connection reliability and ease of mounting on PCBs.

Nominal Supply Voltage: 5 V

5 V nominal supply voltage ensures compatibility with standard digital circuits, making integration straightforward.

PWM Channels: YES

PWM channels enable effective control of motor speeds and LED brightness, enhancing usability in various applications.

ROM Programmability: FLASH

FLASH programmability allows for easy firmware updates and development flexibility, beneficial for prototyping and product lifecycle management.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm allows for easy soldering and compatibility with standard PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates suitable storage and handling practices are required, ensuring reliability during assembly.

Speed: 40 rpm

Operating at 40 rpm indicates capability in low-speed applications without compromising performance.

No. of I/O Lines: 143

An extensive number of I/O lines promotes greater control and connectivity options in embedded applications.

Technical Specifications

Microcontrollers ST10F280-Q3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e2

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

143

No. of Terminals:

208

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.96 mm

Speed:

40 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

ST10F280-Q3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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