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ST10F276-4T3

STMicroelectronics

ST10F276-4T3 by STMicroelectronics

ST10F276-4T3 microcontroller from STMicroelectronics features a 16-bit CPU, operates at 5V with a max temp of 125 °C, and includes 24 ADC channels. Ideal for automotive applications, it offers extensive connectivity options and robust performance. Its compact design ensures efficient integration in various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,339 parts In-Stock

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Digiode

USA . 2,972 parts In-Stock

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Anansix

USA . 2,768 parts In-Stock

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Chip Stock

USA . 582 parts In-Stock

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582

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Distributors (Availability)

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AZTECH Wire

Italy . 338 parts In-Stock

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$20.490

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338

$20.490

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IDEA Electronic Components Group

UK . 399 parts In-Stock

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$22.707

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$20.437

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399

$22.707

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$20.437

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MKK Technologies

India . 2,111 parts In-Stock

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$42.700

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$42.700

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DigiPath Technology Company

USA . 2,111 parts In-Stock

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$42.700

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2,111

$42.700

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Component Stockers USA

USA . 702 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Microchip USA

USA . 5,631 parts In-Stock

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Corphita

USA . 4,167 parts In-Stock

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RC Electronics

USA . 2,140 parts In-Stock

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Parana Technologies

USA . 2,027 parts In-Stock

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$27.150

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Kepictronics

USA . 480 parts In-Stock

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480

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Overview

Unlock the power of innovation with the ST10F276-4T3 microcontroller from STMicroelectronics. Renowned for their commitment to quality and reliability, STMicroelectronics delivers a robust solution ideal for automotive applications and beyond. With its impressive performance in extreme temperatures and advanced connectivity options, this microcontroller ensures seamless integration and efficiency, empowering your projects with unmatched versatility and durability. Experience superior functionality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances reliability and robustness, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

A manageable maximum supply voltage of 5.5 V ensures compatibility with common power sources.

Address Bus Width: 24

A wider address bus width allows for increased memory addressing capability, supporting more complex applications.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on circuit boards.

Bit Size: 16

16-bit architecture provides a balance between performance and resource usage, making it suitable for various applications.

Power Supplies (V): 5

A nominal power supply of 5 V makes it compatible with a wide range of devices and systems.

No. of Terminals: 144

A high number of terminals offers extensive connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low-profile package style is ideal for space-constrained applications while maintaining fine pitch for high pin count.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation in various power environments.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating enables use in demanding conditions, ideal for automotive applications.

CPU Family: ST10

The ST10 CPU family is known for its reliability and performance in embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at a low temperature of -40 °C makes this microcontroller suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability, ensuring reliable and durable connections.

ADC Channels: YES

Integrated ADC channels allow for direct interaction with analog signals, simplifying design and reducing components.

Terminal Position: QUAD

Quad terminal position enables effective thermal management and enhances circuit board layout options.

ROM Words: 212992

A substantial ROM capacity allows for complex program storage, supporting advanced application needs.

Maximum Seated Height: 1.6 mm

Low seated height enhances clearance for various device enclosures, making it adaptable for tight spaces.

Width: 20 mm

A compact width of 20 mm makes it suitable for space-efficient designs without sacrificing functionality.

External Data Bus Width: 16

The 16-bit external data bus width provides efficient data transfer capability, enhancing system performance.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

A wide range of integrated peripherals offers flexibility for diverse applications and reduces the need for external components.

Maximum Clock Frequency: 12 MHz

The 12 MHz clock frequency strikes a balance between performance and power efficiency, suitable for many microcontroller tasks.

Maximum Time At Peak Reflow Temperature (s): 40

Supports standard soldering processes, ensuring reliable assembly without damaging the microcontroller.

Peak Reflow Temperature °C: 260

A high peak reflow temperature rating ensures compatibility with modern surface mount soldering techniques.

Length: 20 mm

Standard length makes it suitable for a variety of board designs and allows for easy replacement and upgrades.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade signifies reliability for use in vehicles, ensuring durability under harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller type ensures optimized performance for embedded system applications.

RAM Bytes: 2048

2048 bytes of RAM provide sufficient workspace for processing data in real-time applications.

Technology: CMOS

CMOS technology enhances power efficiency and improves performance, ideal for low-power applications.

Terminal Form: GULL WING

Gull-wing terminal form is widely used for surface mount technology, ensuring ease of soldering and assembly.

Analog To Digital Convertors: 24-Ch 10-Bit

24-channel 10-bit ADC facilitates extensive analog signal conversion, suitable for multi-sensor applications.

Nominal Supply Voltage: 5 V

5 V nominal supply voltage ensures compatibility with common electrical systems and devices.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors and other devices, enhancing functionality.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Versatile connectivity options enable easy communication with various devices and systems, enhancing integration.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy updating and customization of software, providing flexibility in applications.

Terminal Pitch: 0.5 mm

0.5 mm terminal pitch enables dense packaging, making it suitable for small form-factor designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity, guiding storage and handling procedures.

Speed: 40 rpm

Rpm speed specifications indicate suitability for applications that require moderate speed performance.

On Chip Program ROM Width: 32

A wider program ROM width allows for more extensive programming capabilities in embedded applications.

No. of I/O Lines: 111

A high number of I/O lines enables extensive interfacing capabilities with sensors and peripherals.

Technical Specifications

Microcontrollers ST10F276-4T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

212992

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F276-4T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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