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ST10F273M-4QR3

STMicroelectronics

ST10F273M-4QR3 by STMicroelectronics

ST10F273M-4QR3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at up to 64 MHz, and supports a max supply voltage of 5.5 V. With 144 terminals and integrated ADC channels, it's ideal for automotive applications requiring robust performance. Its compact flatpack design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,672 parts In-Stock

1+ parts

-

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2,672

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Digiode

USA . 2,593 parts In-Stock

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2,593

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Anansix

USA . 871 parts In-Stock

1+ parts

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871

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,030 parts In-Stock

1+ parts

$11.570

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$11.570

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IDEA Electronic Components Group

UK . 1,908 parts In-Stock

1+ parts

$30.337

100+ parts

-

1k+ parts

$27.303

10k+ parts

-

1,908

$30.337

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$27.303

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Ampacity Inc.

Singapore . 605 parts In-Stock

1+ parts

$32.000

100+ parts

-

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605

$32.000

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Microchip USA

USA . 1,059 parts In-Stock

1+ parts

$33.365

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1,059

$33.365

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MKK Technologies

India . 2,153 parts In-Stock

1+ parts

$57.047

100+ parts

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2,153

$57.047

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DigiPath Technology Company

USA . 2,153 parts In-Stock

1+ parts

$57.047

100+ parts

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2,153

$57.047

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Parana Technologies

USA . 2,283 parts In-Stock

1+ parts

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100+ parts

$36.272

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2,283

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$36.272

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Corphita

USA . 633 parts In-Stock

1+ parts

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633

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Overview

Unlock the power of innovation with the ST10F273M-4QR3 microcontroller from STMicroelectronics, a leader in quality and reliability. Its robust performance caters to automotive applications, ensuring unmatched durability in extreme environments. With advanced connectivity options and versatile peripherals, this microcontroller streamlines design while enhancing efficiency. Experience seamless integration and superior functionality that drives your projects to new heights. Choose STMicroelectronics for excellence you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and simplifies the assembly process, providing an advantage in modern PCB designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V offers flexibility in power supply options and protects the device from over-voltage conditions.

Address Bus Width: 24

A wider address bus allows for more addressable memory locations, enhancing the capability of the microcontroller in handling data.

Package Shape: SQUARE

The square package shape is commonly used in applications to optimize space on PCB layouts.

Bit Size: 16

A 16-bit architecture can efficiently handle a variety of applications, balancing performance with power consumption.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5 V ensures compatibility with many existing systems and power supplies.

Number of Terminals: 144

Having 144 terminals provides ample I/O options, enabling complex interfacing capabilities for various peripherals.

Package Style (Meter): FLATPACK

Flatpack style facilitates efficient surface mounting and addresses space constraints in electronics design.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliability in various operating conditions, accommodating a variety of applications.

Maximum Operating Temperature: 125 °C

Withstanding high operating temperatures makes this microcontroller suitable for automotive and industrial environments.

CPU Family: ST10

The ST10 family is known for its performance and ability to handle complex algorithms, making it a strong choice for advanced applications.

Minimum Operating Temperature: -40 °C

Operation at temperatures as low as -40 °C makes this microcontroller suitable for harsh, outdoor, or industrial applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and is resistant to corrosion, improving longevity and reliability.

ADC Channels: YES

Built-in ADC channels enable real-time sensing capabilities, making it ideal for applications requiring analog input processing.

Terminal Position: QUAD

Quad terminal position allows for efficient routing on PCB and enhances the overall design flexibility.

ROM Words: 131072

A larger ROM capacity facilitates the storage of extensive firmware or application code, enhancing the device's functionality.

Maximum Seated Height: 4.07 mm

Minimal seated height supports compact designs, essential for applications with limited space.

Width: 28 mm

The standard width allows easy integration into various form factors and PCB layouts.

External Data Bus Width: 16

A 16-bit external data bus width enhances data transfer performance, especially with high-speed peripherals.

Peripherals: PWM(8), RTC, TIMER(5), WDT

Multiple built-in peripherals reduce the need for external components, streamlining design and improving reliability.

Maximum Clock Frequency: 64 MHz

A maximum clock frequency of 64 MHz allows for high-speed processing, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

A longer peak reflow time can improve soldering quality during assembly, reducing defects.

Peak Reflow Temperature (°C): 245

Ability to withstand peak reflow temperatures is important for compatibility with modern soldering processes.

Length: 28 mm

Standard length makes it easier to design PCBs and integrate with other standard components.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are built to withstand the rigorous demands of the automotive environment, ensuring durability.

Peripheral IC Type: MICROCONTROLLER

Versatile peripheral integration as a microcontroller makes this device suitable for a wide range of applications.

RAM Bytes: 36864

Adequate RAM allows for efficient processing of data and supports complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high density of functionality, making this product energy efficient.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connections, enhancing manufacturing and assembly processes.

Analog To Digital Converters: 24-Ch 10-Bit

Support for multiple 10-bit ADC channels broadens the device's application in analog signal processing.

Nominal Supply Voltage: 5 V

Compatible with standard 5 V systems, this microcontroller is easy to integrate and power.

PWM Channels: YES

Integrated PWM channels facilitate efficient control for motors and other actuators, adding versatility to the design.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple connectivity options enhance communication abilities, allowing integration into a variety of systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and changes to firmware, extending the product's lifecycle.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is suitable for fine-pitch designs, aiding in compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this product can handle moderate moisture conditions during storage and assembly.

Speed: 64 rpm

This speed rating indicates suitability for applications that require controlled motion, such as robotics.

On Chip Program ROM Width: 32

A 32-bit on-chip program ROM width allows for efficient processing and larger instruction sets.

Number of I/O Lines: 111

111 I/O lines provide extensive interfacing capabilities to support a wide range of peripheral devices.

Technical Specifications

Microcontrollers ST10F273M-4QR3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F273M-4QR3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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