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ST10F272Z2Q3

STMicroelectronics

ST10F272Z2Q3 by STMicroelectronics

ST10F272Z2Q3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at up to 64 MHz, and supports a max supply voltage of 5.5 V. With 144 terminals and automotive-grade temperature range (-40 °C to 125 °C), it's ideal for automotive applications. Its flash ROM allows for flexible programming, making it versatile for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,676 parts In-Stock

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8,676

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Digiode

USA . 2,485 parts In-Stock

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2,485

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Anansix

USA . 1,272 parts In-Stock

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1,272

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Distributors (Availability)

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AZTECH Wire

Italy . 1,072 parts In-Stock

1+ parts

$10.240

100+ parts

-

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1,072

$10.240

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Microchip USA

USA . 276 parts In-Stock

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$23.723

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276

$23.723

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IDEA Electronic Components Group

UK . 599 parts In-Stock

1+ parts

$27.334

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-

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$24.601

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599

$27.334

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$24.601

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MKK Technologies

India . 1,899 parts In-Stock

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$51.400

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1,899

$51.400

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DigiPath Technology Company

USA . 1,899 parts In-Stock

1+ parts

$51.400

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1,899

$51.400

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QUARKTWIN TECHNOLOGY LTD

USA . 28,931 parts In-Stock

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28,931

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Corphita

USA . 4,510 parts In-Stock

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4,510

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Parana Technologies

USA . 20 parts In-Stock

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$32.682

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20

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$32.682

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Overview

Unlock unparalleled efficiency and reliability with the ST10F272Z2Q3 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive applications, this high-performance device combines robust processing power with exceptional temperature resilience, ensuring optimal operation in demanding environments. Experience seamless integration and versatility, empowering your projects with enhanced functionality and durability that elevate your products to new heights. Choose STMicroelectronics for unmatched quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space, enabling compact designs and ease of integration.

Maximum Supply Voltage: 5.5 V

Supporting a maximum supply voltage of 5.5 V provides flexibility in power supply options without risking damage to the device.

Address Bus Width: 24

A 24-bit address bus width allows for a larger memory addressing capability, increasing the versatility of applications.

Package Shape: SQUARE

The square package shape aids in efficient PCB layout and signal integrity, facilitating better performance.

Bit Size: 16

The 16-bit architecture provides a good balance of performance and power consumption for a variety of applications.

Power Supplies (V): 5

Standard 5V power supply compatibility makes it easy to integrate this microcontroller with common electronic systems.

No. of Terminals: 144

With 144 terminals, this microcontroller offers ample connectivity options for a wide range of peripherals.

Package Style (Meter): FLATPACK

The flatpack style allows for efficient thermal management and a smaller footprint on the PCB.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation across various power conditions.

Maximum Operating Temperature: 125 °C

Rated for high temperatures up to 125 °C, this microcontroller is suitable for automotive and industrial applications.

CPU Family: ST10

The ST10 CPU family is known for its efficiency and reliability, making it a trusted choice in embedded systems.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures from -40 °C ensures the microcontroller functions effectively in harsh environments.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing, enhancing its capability in sensor applications.

Terminal Position: QUAD

Quad terminal positioning simplifies the layout and improves electrical performance.

ROM Words: 262144

A ROM capacity of 262,144 words provides substantial space for program storage, supporting complex applications.

Maximum Seated Height: 4.07 mm

Low-profile design at 4.07 mm maximizes space efficiency and enhances the integration into tight spaces.

Width: 28 mm

The compact width of 28 mm helps facilitate a space-efficient design in various applications.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient communication with other devices, enhancing performance.

Maximum Clock Frequency: 64 MHz

Operating at a maximum clock frequency of 64 MHz provides sufficient speed for complex computing tasks.

Length: 28 mm

The length of 28 mm contributes to a cohesive dimensional design for compact assemblies.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets stringent industry standards for reliability.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it can serve as the central processing unit for embedded applications, enhancing overall functionality.

RAM Bytes: 20480

With 20,480 bytes of RAM, it allows for efficient variable storage and data manipulation for applications.

Technology: CMOS

Utilizing CMOS technology results in lower power consumption, extended battery life, and improved performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical stability on the PCB.

Nominal Supply Voltage: 5 V

At a nominal supply voltage of 5 V, this microcontroller is compatible with typical digital circuits, simplifying design.

PWM Channels: YES

Presence of PWM channels supports control of motors and other actuators, broadening its application range.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and upgrades, enhancing flexibility in development.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density packing on PCBs, optimizing space utilization.

Speed: 64 rpm

Operating at 64 rpm is indicative of its efficiency in low-speed applications, enhancing its versatility.

No. of I/O Lines: 111

With 111 I/O lines, this microcontroller provides extensive connectivity options for various devices and sensors.

Technical Specifications

Microcontrollers ST10F272Z2Q3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10F272Z2Q3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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