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ST10F272M-4TR3

STMicroelectronics

ST10F272M-4TR3 by STMicroelectronics

ST10F272M-4TR3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at 5V with a max temp of 125 °C, and includes 24 ADC channels. Ideal for automotive applications, it supports various connectivity options like CAN and I2C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,220 parts In-Stock

1+ parts

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10,220

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Digiode

USA . 2,495 parts In-Stock

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2,495

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Anansix

USA . 1,304 parts In-Stock

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1,304

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 209 parts In-Stock

1+ parts

$1.000

100+ parts

-

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209

$1.000

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AZTECH Wire

Italy . 1,099 parts In-Stock

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$11.380

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1,099

$11.380

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Semicontronic

India . 283 parts In-Stock

1+ parts

$17.000

100+ parts

$16.575

1k+ parts

$16.490

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283

$17.000

$16.575

$16.490

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IDEA Electronic Components Group

UK . 1,718 parts In-Stock

1+ parts

$34.885

100+ parts

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$31.396

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1,718

$34.885

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$31.396

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MKK Technologies

India . 1,590 parts In-Stock

1+ parts

$65.598

100+ parts

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1,590

$65.598

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DigiPath Technology Company

USA . 1,590 parts In-Stock

1+ parts

$65.598

100+ parts

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1,590

$65.598

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Component Stockers USA

USA . 25,000 parts In-Stock

1+ parts

$325.000

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25,000

$325.000

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Corphita

USA . 4,159 parts In-Stock

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4,159

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Parana Technologies

USA . 2,153 parts In-Stock

1+ parts

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100+ parts

$41.710

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2,153

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$41.710

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Overview

Unlock the potential of your next project with the ST10F272M-4TR3 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics offers a robust solution that excels in automotive applications. With exceptional performance, low power consumption, and advanced peripherals, this versatile chip empowers you to create smarter, more efficient systems. Experience reliability and superior technology designed to elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and makes the microcontroller easily integrable into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a wide range of power supply designs and applications.

Address Bus Width: 24

A 24-bit address bus width enables access to a larger addressable memory space, which is beneficial for complex applications.

Package Shape: SQUARE

The square package shape maximizes space efficiency on the PCB, contributing to a compact and organized layout.

Bit Size: 16

A 16-bit size provides a balance between performance and efficiency, making it suitable for various embedded applications.

Power Supplies (V): 5

The nominal supply voltage of 5 V aligns with common electronic components, ensuring easy integration and compatibility.

No. of Terminals: 144

With 144 terminals, this microcontroller supports a vast array of I/O configurations, making it versatile for complex projects.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style allows for a low-profile design, which is advantageous for height-sensitive applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stability and reliability in various operating conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for automotive and harsh environments.

CPU Family: ST10

As part of the ST10 family, this microcontroller is well-supported with a wide range of development tools and resources.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature allows for deployment in extreme environments, making it ideal for outdoor and automotive applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and provides good oxidation resistance, ensuring reliable connections.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interface with analog sensors, broadening its application potential.

Terminal Position: QUAD

Quad terminal positioning allows for a more efficient use of PCB space and better thermal management.

ROM Words: 65536

With 65,536 ROM words, this microcontroller can store complex programs and firmware, accommodating sophisticated applications.

Maximum Seated Height: 1.6 mm

The low seated height enables a slim profile, making it suitable for compact designs that require space efficiency.

Width: 20 mm

A standard width of 20 mm allows for easy integration into common PCB layouts.

External Data Bus Width: 16

A 16-bit external data bus enhances communication speed with external devices, improving overall system performance.

Peripherals: PWM(8), RTC, TIMER(5), WDT

The inclusion of multiple peripherals allows for a range of functionalities, making it suited for diverse applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures adequate processing speed for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification demonstrates compatibility with standard soldering processes, thus ensuring easy assembly and manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness during manufacturing, making it suitable for high-temperature applications.

Length: 20 mm

A length of 20 mm fits well in standard enclosures, allowing for flexible designs in various applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets high-quality standards required for reliability and performance in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction execution, enabling faster processing and lower power consumption.

RAM Bytes: 20480

With 20,480 bytes of RAM, this microcontroller supports complex algorithms and data processing.

Technology: CMOS

Using CMOS technology enhances power efficiency and provides a high level of integration, which is ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability in PCB assembly.

Analog To Digital Convertors: 24-Ch 10-Bit

The presence of multiple 24-channel, 10-bit ADCs enables rich data acquisition from various sources, expanding application possibilities.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V complements many other components, simplifying circuit design.

PWM Channels: YES

The availability of PWM channels allows for precise control of motors and other devices, particularly useful in automation.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple connectivity options ensure compatibility with various communication protocols, making integration into systems easier.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware without needing physical changes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a compact layout, essential for modern high-density PCBs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates robust packaging suitable for standard soldering processes with proper handling.

Speed: 40 rpm

The specified speed ensures adequate performance for applications requiring precise control and responsiveness.

On Chip Program ROM Width: 32

The 32-bit program ROM width provides enhanced data handling capabilities, suitable for more complex applications.

No. of I/O Lines: 111

Having 111 I/O lines allows for extensive interfacing possibilities with other components, making it highly versatile.

Technical Specifications

Microcontrollers ST10F272M-4TR3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F272M-4TR3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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