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ST10F271Z1Q3

STMicroelectronics

ST10F271Z1Q3 by STMicroelectronics

ST10F271Z1Q3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at a max voltage of 5.5V, and supports up to 64 MHz clock frequency. With 144 terminals and automotive-grade temperature range (-40 °C to 125 °C), it's ideal for automotive applications. Its flash ROM allows for flexible programming, making it suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,521 parts In-Stock

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3,521

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Digiode

USA . 2,062 parts In-Stock

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2,062

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Anansix

USA . 1,767 parts In-Stock

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1,767

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Pegasus Components GmbH

Germany . 480 parts In-Stock

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480

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$16.550

100+ parts

-

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799

$16.550

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Microchip USA

USA . 203 parts In-Stock

1+ parts

$25.007

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203

$25.007

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

1+ parts

$30.703

100+ parts

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$27.633

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2,369

$30.703

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$27.633

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MKK Technologies

India . 1,606 parts In-Stock

1+ parts

$57.735

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1,606

$57.735

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DigiPath Technology Company

USA . 1,606 parts In-Stock

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$57.735

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1,606

$57.735

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Parana Technologies

USA . 2,260 parts In-Stock

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$36.710

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2,260

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$36.710

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Corphita

USA . 1,805 parts In-Stock

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1,805

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Overview

Unlock the potential of your innovative projects with the ST10F271Z1Q3 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for automotive applications, this versatile device offers robust performance, exceptional reliability, and a compact package that fits seamlessly into your designs. Enjoy enhanced efficiency, advanced features like ADC and PWM channels, and the peace of mind that comes from choosing a trusted manufacturer dedicated to driving your success. Elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic systems.

Maximum Supply Voltage: 5.5 V

Compatible with standard power supplies, providing flexibility in system design.

Address Bus Width: 24

A wider address bus enables access to a larger memory space, enhancing performance for complex applications.

Package Shape: SQUARE

Square package shape facilitates efficient use of board space and easier mounting.

Bit Size: 16

The 16-bit architecture provides a good balance of performance and efficiency, suitable for a variety of applications.

Power Supplies (V): 5

Standard 5V supply is widely available and ensures compatibility with various electronic components.

No. of Terminals: 144

A high number of terminals allows for extensive connectivity options, making it versatile for various applications.

Package Style (Meter): FLATPACK

Flatpack style contributes to a low profile in electronic designs, saving space.

Minimum Supply Voltage: 4.5 V

This range of supply voltage allows for stable operation in various power conditions.

Maximum Operating Temperature: 125 °C

High-temperature tolerance makes this microcontroller suitable for demanding automotive and industrial applications.

CPU Family: ST10

ST10 family provides robust processing power and is widely supported in the industry.

Minimum Operating Temperature: -40 °C

Extended operational temperature range makes it ideal for use in extreme environments.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and reduces oxidation, enhancing long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog signals, increasing system capabilities.

Terminal Position: QUAD

Quad terminal positioning improves PCB design flexibility and component placement options.

ROM Words: 131072

Generous ROM capacity facilitates storage of complex applications and firmware.

Maximum Seated Height: 4.07 mm

Compact height makes it suitable for space-constrained designs in portable devices.

Width: 28 mm

28 mm width balances size with functionalities, making it easy to integrate in diverse applications.

External Data Bus Width: 16

16-bit data bus width aids in faster data transfer rates, enhancing overall system performance.

Maximum Clock Frequency: 64 MHz

A high clock frequency allows for faster processing and improved performance in applications.

Length: 28 mm

The length complements the width, making it easy to fit in standard electronic enclosures.

Temperature Grade: AUTOMOTIVE

Certified for automotive use, ensuring reliability and performance in harsh automotive environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates CPU, memory, and peripherals in a single package for compact design.

RAM Bytes: 12288

Adequate RAM size supports multitasking and complex operations, enhancing performance significantly.

Technology: CMOS

CMOS technology provides low power consumption, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the reliability of connections.

Nominal Supply Voltage: 5 V

Nominal voltage is standard in the industry, ensuring compatibility with a wide range of devices.

PWM Channels: YES

Integrated PWM channels are perfect for control applications, such as motor driving and signal modulation.

ROM Programmability: FLASH

Flash ROM supports easy reprogramming, allowing updates and modifications without hardware changes.

Terminal Pitch: 0.65 mm

Smaller terminal pitch allows for increased density in PCB layouts, saving space in designs.

Speed: 64 rpm

This speed is adequate for most automotive and industrial applications, ensuring effective operation.

No. of I/O Lines: 111

A high number of I/O lines provides extensive interfacing capabilities for various peripherals and devices.

Technical Specifications

Microcontrollers ST10F271Z1Q3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10F271Z1Q3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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