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ST10F269Z2T6

STMicroelectronics

ST10F269Z2T6 by STMicroelectronics

ST10F269Z2T6 microcontroller from STMicroelectronics features a 16-bit architecture with a max clock frequency of 80 MHz and operates b/w -40 °C to 85 °C. It supports up to 111 I/O lines and includes ADC and PWM channels, ideal for industrial applications. Packaged in a low-profile flatpack, it ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,159 parts In-Stock

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4,159

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Digiode

USA . 1,672 parts In-Stock

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1,672

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Anansix

USA . 1,594 parts In-Stock

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1,594

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Distributors (Availability)

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AZTECH Wire

Italy . 969 parts In-Stock

1+ parts

$13.390

100+ parts

-

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969

$13.390

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Microchip USA

USA . 305 parts In-Stock

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$45.104

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305

$45.104

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IDEA Electronic Components Group

UK . 160 parts In-Stock

1+ parts

$49.007

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$44.107

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160

$49.007

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$44.107

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MKK Technologies

India . 189 parts In-Stock

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$92.155

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189

$92.155

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DigiPath Technology Company

USA . 189 parts In-Stock

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$92.155

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189

$92.155

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Corphita

USA . 2,698 parts In-Stock

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2,698

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Parana Technologies

USA . 848 parts In-Stock

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$58.596

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848

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$58.596

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Overview

Unlock innovation with the ST10F269Z2T6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for efficiency and reliability, this versatile chip excels in demanding applications like industrial automation, automotive systems, and consumer electronics. With robust performance, low power consumption, and exceptional quality, it empowers engineers to create smarter solutions faster, ensuring your projects are future-ready and competitive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material enhances the longevity and reliability of the microcontroller in various applications.

Surface Mount: YES

Enables compact designs and facilitates automated assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

This flexibility allows compatibility with a wide range of power supply configurations.

Address Bus Width: 24

A wider address bus allows for a larger memory addressing capability, supporting complex applications.

Package Shape: SQUARE

The square shape is often easier to integrate into PCB layouts and provides efficient space utilization.

Bit Size: 16

A 16-bit architecture provides a balance between processing capability and power consumption, suitable for many applications.

Power Supplies (V): 5

Utilizing a standard voltage improves compatibility with various systems and simplifies design.

No. of Terminals: 144

A higher number of terminals allows for more peripherals and features to be connected, increasing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style is beneficial for applications that require low-profile components and precision in placement.

Minimum Supply Voltage: 4.5 V

This low operational voltage enhances energy efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

This capability ensures reliable performance in high-temperature environments commonly found in industrial applications.

CPU Family: ST10

The ST10 family is recognized for robust performance and versatility in embedded systems.

Minimum Operating Temperature: -40 °C

This extended temperature range ensures operation in extreme conditions, ideal for industrial and automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent corrosion resistance and reliable electrical contacts, enhancing durability.

ADC Channels: YES

Incorporating ADC channels allows for effective analog signal processing, crucial for sensor applications.

Terminal Position: QUAD

This positioning optimizes space and enhances the ease of routing on circuit boards.

ROM Words: 262144

A substantial ROM capacity enables extensive program storage, crucial for complex applications.

Maximum Seated Height: 1.6 mm

A low seated height helps maintain a compact design and fits into thinner devices.

Width: 20 mm

A standard width allows for versatility in application across various form factors.

External Data Bus Width: 16

A 16-bit external data bus supports faster data transfer rates, improving overall system performance.

Maximum Clock Frequency: 80 MHz

High clock speed ensures the microcontroller can handle demanding processing tasks efficiently.

Length: 20 mm

Its compact length enhances design flexibility for various applications.

Temperature Grade: INDUSTRIAL

This specification confirms the device’s reliability and durability in harsh operational conditions.

Peripheral IC Type: MICROCONTROLLER

Versatile microcontroller functionality supports a range of applications from simple to complex.

RAM Bytes: 12288

Ample RAM capacity allows for efficient processing and handling of complex data operations.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making it suitable for battery-powered devices.

Terminal Form: GULL WING

This terminal form is ideal for automated soldering and improves connection reliability.

Maximum Supply Current: 93.6 mA

A manageable supply current ensures energy efficiency while maintaining performance.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies integration and design compatibility.

PWM Channels: YES

PWM channels facilitate control of motors and lighting, crucial for embedded systems.

ROM Programmability: FLASH

FLASH programmability allows for easy firmware updates and customization, extending product lifespan.

Terminal Pitch: 0.5 mm

A fine pitch allows for more compact designs and higher terminal density.

Speed: 40 rpm

This speed is suitable for applications needing precise control in low-speed environments.

No. of I/O Lines: 111

A high number of I/O lines enables versatile interfacing with multiple devices and enhances application capabilities.

Technical Specifications

Microcontrollers ST10F269Z2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

93.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

ST10F269Z2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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