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SRIX512-W4/XXX

STMicroelectronics

SRIX512-W4/XXX by STMicroelectronics

SRIX512-W4/XXX from STMicroelectronics is a CMOS memory IC with a 512-bit density, operating asynchronously b/w -20 °C and 85°C. It features a supply voltage range of 2.5V to 3.5V and comes in an uncasded chip form factor. Ideal for compact applications requiring efficient data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,753 parts In-Stock

1+ parts

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2,753

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Anansix

USA . 2,034 parts In-Stock

1+ parts

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-

1k+ parts

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2,034

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Digiode

USA . 1,538 parts In-Stock

1+ parts

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1,538

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,196 parts In-Stock

1+ parts

$2.534

100+ parts

-

1k+ parts

$2.280

10k+ parts

-

1,196

$2.534

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$2.280

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MKK Technologies

India . 2,015 parts In-Stock

1+ parts

$4.764

100+ parts

-

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2,015

$4.764

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DigiPath Technology Company

USA . 2,015 parts In-Stock

1+ parts

$4.764

100+ parts

-

1k+ parts

-

10k+ parts

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2,015

$4.764

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Corphita

USA . 2,887 parts In-Stock

1+ parts

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2,887

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Parana Technologies

USA . 308 parts In-Stock

1+ parts

-

100+ parts

$3.029

1k+ parts

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10k+ parts

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308

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$3.029

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Overview

Unlock the potential of your designs with the SRIX512-W4/XXX from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a reliable memory solution perfect for diverse applications. This compact, asynchronous memory IC ensures seamless performance across varying temperatures, making it ideal for automotive, industrial, and consumer electronics. Elevate your projects with enhanced efficiency and exceptional value—experience the STMicroelectronics difference today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact placement on PCBs, making it an ideal choice for space-constrained applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies integration with existing systems, allowing for easier design and faster data access.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V ensures compatibility with a wide range of devices and reduces power consumption.

Package Style (Meter): UNCASED CHIP

The uncased chip design offers flexibility in custom PCB layouts and can be easier to integrate into unique applications.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes this IC suitable for use in environments with thermal challenges.

Organization: 16X32

This memory organization structure allows for efficient data storage and retrieval, enhancing performance in various applications.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, this IC is reliable in various climatic conditions, extending its usage range.

Terminal Position: UPPER

Upper terminal positioning simplifies soldering and connectivity during assembly, streamlining the manufacturing process.

Minimum Supply Voltage (Vsup): 2.5 V

A minimum supply voltage of 2.5V allows for flexibility in power supply options, making it adaptable to different system designs.

Technology: CMOS

CMOS technology provides low power consumption and higher speed, making this memory IC efficient for modern applications.

Terminal Form: NO LEAD

No lead configuration prevents corrosion and enhances reliability, making the IC durable for prolonged use.

No. of Words: 16 words

With 16 words of storage, this IC is suitable for straightforward applications requiring basic memory functionality.

Memory Width: 32

A memory width of 32 allows for efficient data processing and improves overall system throughput.

No. of Words Code: 16

Having 16 words code signifies ease of coding and programming, making it user-friendly for developers.

Maximum Supply Voltage (Vsup): 3.5 V

A maximum supply voltage of 3.5V ensures stable operation under various conditions, enhancing device reliability.

Memory Density: 512 bit

A memory density of 512 bits offers a suitable balance of capacity for applications needing moderate data storage.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit type IC, it is designed specifically for efficient data storage and retrieval, making it ideal for various applications.

Technical Specifications

Other Function Memory ICs SRIX512-W4/XXX attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Memory Density:

512 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

16X32

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SRIX512-W4/XXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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