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SRIX4K-W4/XXX

STMicroelectronics

SRIX4K-W4/XXX by STMicroelectronics

SRIX4K-W4/XXX by STMicroelectronics is a CMOS memory IC designed for asynchronous operation with a supply voltage range of 2.5V to 3.5V. It features a memory density of 4096 bits and operates b/w -20 °C and 85°C, making it ideal for commercial applications in various environments. Its compact uncasded chip design allows for efficient surface mounting in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,063 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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3,063

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-

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Anansix

USA . 981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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981

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Digiode

USA . 665 parts In-Stock

1+ parts

-

100+ parts

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665

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,608 parts In-Stock

1+ parts

$3.427

100+ parts

-

1k+ parts

$3.084

10k+ parts

-

1,608

$3.427

-

$3.084

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MKK Technologies

India . 2,012 parts In-Stock

1+ parts

$6.444

100+ parts

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2,012

$6.444

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DigiPath Technology Company

USA . 2,012 parts In-Stock

1+ parts

$6.444

100+ parts

-

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-

2,012

$6.444

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Corphita

USA . 2,377 parts In-Stock

1+ parts

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2,377

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Parana Technologies

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$4.098

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115

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$4.098

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Overview

Unlock superior performance with the SRIX4K-W4/XXX from STMicroelectronics, a trusted leader in innovative memory solutions. This robust memory IC excels in diverse applications, delivering reliability and efficiency under varying conditions. With its compact design and low power consumption, it seamlessly integrates into your projects, offering tremendous value and enhancing your product's capabilities. Elevate your designs with ST’s commitment to quality and innovation!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact devices, saving space and enabling high-density PCB layouts.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode ensures faster response times, contributing to better overall performance in applications where speed is critical.

Nominal Supply Voltage / Vsup: 3 V

Operating at a nominal voltage of 3V optimizes power consumption while ensuring compatibility with other low-voltage components.

Package Style (Meter): UNCASED CHIP

The uncased chip package offers flexibility in mounting configurations and is preferable for applications requiring custom designs.

Maximum Operating Temperature: 85 °C

With a maximum temperature rating of 85 °C, this IC can operate reliably in a wide range of environments, including industrial settings.

Organization: 128X32

The 128X32 organization provides a structured memory format, making it suitable for various applications, from simple data storage to complex data processing.

Minimum Operating Temperature: -20 °C

The capability to operate at -20 °C allows this IC to function in colder environments, broadening its application range.

Terminal Position: UPPER

The upper terminal position can simplify PCB design and layout, making assembly easier and more efficient.

Minimum Supply Voltage (Vsup): 2.5 V

The ability to function with a minimum supply voltage of 2.5V enhances its versatility and compatibility with a variety of power sources.

Temperature Grade: COMMERCIAL EXTENDED

Being classified as commercial extended means this IC can operate in more demanding temperature ranges, making it suitable for varied commercial applications.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, making this memory IC ideal for battery-powered applications.

Terminal Form: NO LEAD

The no-lead terminal form enables better thermal and electrical performance and allows for a more compact design.

No. of Words: 128 words

With 128 words of storage, the memory IC caters to a diverse range of applications without sacrificing performance for size.

Memory Width: 32

A memory width of 32 bits provides sufficient data handling capabilities, suitable for many processing requirements.

No. of Words Code: 128

The 128 words code enables effective organization of data, making it easier to manage and access stored information.

Maximum Supply Voltage (Vsup): 3.5 V

The maximum supply voltage of 3.5V offers compatibility with a wider range of power supplies, allowing for more flexible designs.

Memory Density: 4096 bit

With a memory density of 4096 bits, this IC provides a balanced capacity for efficient data storage and processing.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit IC, it is designed specifically for storage functions, ensuring high reliability and performance in memory-related tasks.

Technical Specifications

Other Function Memory ICs SRIX4K-W4/XXX attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

128X32

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SRIX4K-W4/XXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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