Loading...

SRIX4K-W4/1GE

STMicroelectronics

SRIX4K-W4/1GE by STMicroelectronics

SRIX4K-W4/1GE by STMicroelectronics is a CMOS memory IC with a density of 4096 bits, operating asynchronously at supply voltages b/w 2.5V and 3.5V. It features a temperature range from -25 °C to 85°C and comes in an uncasded chip form. Ideal for various applications requiring compact memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,736

-

-

-

-

Vyrian

USA . 1,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,189

-

-

-

-

Anansix

USA . 963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

963

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,342 parts In-Stock

1+ parts

$4.797

100+ parts

-

1k+ parts

$4.317

10k+ parts

-

1,342

$4.797

-

$4.317

-

MKK Technologies

India . 1,925 parts In-Stock

1+ parts

$9.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,925

$9.020

-

-

-

DigiPath Technology Company

USA . 1,925 parts In-Stock

1+ parts

$9.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,925

$9.020

-

-

-

Corphita

USA . 2,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,734

-

-

-

-

Parana Technologies

USA . 920 parts In-Stock

1+ parts

-

100+ parts

$5.735

1k+ parts

-

10k+ parts

-

920

-

$5.735

-

-

Overview

Unlock limitless possibilities with the SRIX4K-W4/1GE from STMicroelectronics, a trusted name in cutting-edge technology. This versatile memory IC combines exceptional performance and reliability, making it perfect for a wide range of applications, from industrial automation to smart devices. With its robust operating range and surface mount design, it ensures seamless integration into your projects, delivering consistent power efficiency and enhanced functionality for today's demanding requirements. Experience quality that stands out!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact assembly on PCBs, enabling efficient space management and integration into various applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in data handling, allowing for simpler designs and improved performance in applications requiring instantaneous access.

Nominal Supply Voltage / Vsup: 3 V

With a nominal supply voltage of 3V, this IC is well-suited for low-power applications, contributing to energy efficiency and longer battery life.

Package Style (Meter): UNCASED CHIP

The uncased chip style enables custom packaging solutions and integration directly into diverse designs, maximizing flexibility.

Maximum Operating Temperature: 85 °C

Designed to operate reliably up to 85 °C, this IC is suitable for use in a variety of environments, including industrial applications where temperature control may be challenging.

Organization: 128X32

The 128x32 organization allows for significant data handling capabilities, making it ideal for applications that require efficient data storage and manipulation.

Minimum Operating Temperature: -25 °C

Operating down to -25 °C ensures reliable performance even in cold environments, expanding the range of potential applications.

Terminal Position: UPPER

Upper terminal positioning aids in easier access for connections, facilitating simplified PCB layout and assembly processes.

Minimum Supply Voltage (Vsup): 2.5 V

The ability to operate at a minimum of 2.5V adds versatility and compatibility with a wide range of low-voltage systems.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making it particularly suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals eliminate the need for traditional soldering, simplifying assembly and reducing environmental impact.

No. of Words: 128 words

With 128 words available, this memory IC provides adequate data storage for various applications, suitable for both small and medium-sized data requirements.

Memory Width: 32

A memory width of 32 allows for efficient data handling and processing, making this IC suitable for applications requiring quick data retrieval.

No. of Words Code: 128

The 128 words code indicates robust memory configuration, perfect for systems that need reliable, scalable storage solutions.

Maximum Supply Voltage (Vsup): 3.5 V

Supporting a maximum supply voltage of 3.5V provides design flexibility for integration into a variety of electronic systems without compromising performance.

Memory Density: 4096 bit

With a memory density of 4096 bits, this IC balances performance and space, making it suitable for high-density applications in smaller form factors.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, it is optimized for data storage applications, ensuring reliability and effectiveness in various electronic systems.

Technical Specifications

Other Function Memory ICs SRIX4K-W4/1GE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

128X32

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SRIX4K-W4/1GE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5