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SRIX512-SBN18/XXX

STMicroelectronics

SRIX512-SBN18/XXX by STMicroelectronics

SRIX512-SBN18/XXX by STMicroelectronics is a CMOS memory IC with a 512-bit density, operating asynchronously b/w 2.5V and 3.5V. It features a temperature range of -20 °C to 85°C and comes in an uncasded chip form factor. Ideal for compact applications requiring efficient data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,486 parts In-Stock

1+ parts

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4,486

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Vyrian

USA . 1,894 parts In-Stock

1+ parts

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1,894

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Anansix

USA . 1,271 parts In-Stock

1+ parts

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1,271

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 237 parts In-Stock

1+ parts

$4.940

100+ parts

-

1k+ parts

$4.446

10k+ parts

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237

$4.940

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$4.446

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MKK Technologies

India . 1,908 parts In-Stock

1+ parts

$9.290

100+ parts

-

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1,908

$9.290

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DigiPath Technology Company

USA . 1,908 parts In-Stock

1+ parts

$9.290

100+ parts

-

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1,908

$9.290

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Corphita

USA . 3,429 parts In-Stock

1+ parts

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3,429

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Parana Technologies

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$5.907

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850

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$5.907

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Overview

Elevate your projects with the SRIX512-SBN18/XXX from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile memory IC delivers reliable performance across various applications, ensuring seamless operation in even the most demanding environments. With its compact design and wide operational temperature range, it’s perfect for consumer electronics, industrial automation, and beyond. Experience unmatched quality and efficiency that empowers your designs to excel!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization and simplifies the integration into compact electronic devices.

Operating Mode: ASYNCHRONOUS

The asynchronous operation enhances performance by allowing faster data access without the need for clock signals.

Nominal Supply Voltage / Vsup: 3 V

A nominal supply voltage of 3V is standard for many applications, ensuring compatibility with a wide range of devices.

Package Style (Meter): UNCASED CHIP

The uncased chip format offers flexibility for custom packaging solutions, allowing for tailored integration into various applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for environments with moderate heat, ensuring reliable performance.

Organization: 16X32

The 16x32 organization allows for efficient data handling, fitting well within various architectural designs.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C ensures functionality in colder environments, extending application versatility.

Terminal Position: UPPER

With terminal positioning on the upper side, this design facilitates easier access and soldering in circuit board layouts.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V allows for operation in low-power applications, supporting energy-efficient designs.

Technology: CMOS

Using CMOS technology provides low power consumption and high speed, making this memory IC ideal for modern digital circuits.

Terminal Form: NO LEAD

The no-lead form factor contributes to a smaller footprint on the PCB, optimizing space while providing reliable connections.

No. of Words: 16 words

Having 16 words available offers sufficient data capacity for simple applications without excess complexity.

Memory Width: 32

A memory width of 32 bits allows for efficient data processing, supporting contemporary data handling requirements.

No. of Words Code: 16

This specification ensures ease of programming and control, suitable for basic memory tasks.

Maximum Supply Voltage (Vsup): 3.5 V

The capability to operate at a maximum of 3.5V provides flexibility in supply voltage designs, accommodating various circuit configurations.

Memory Density: 512 bit

With a memory density of 512 bits, this IC balances capacity and space efficiency, fitting well in compact applications.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit type, this IC is specifically designed for data storage tasks, ensuring optimal performance in storage applications.

Technical Specifications

Other Function Memory ICs SRIX512-SBN18/XXX attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Memory Density:

512 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

16X32

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

SRIX512-SBN18/XXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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