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PSD854F2V-12MI

STMicroelectronics

PSD854F2V-12MI by STMicroelectronics

PSD854F2V-12MI by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 3.0V and 3.6V. It features a compact flatpack design and operates in extreme temperatures from -40 °C to 85°C, ideal for industrial applications. With a max access time of just 120 ns, it ensures efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,282 parts In-Stock

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7,282

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Digiode

USA . 3,818 parts In-Stock

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3,818

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Anansix

USA . 2,782 parts In-Stock

1+ parts

-

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2,782

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Avant Electronics Limited

UK . 2,434 parts In-Stock

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-

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2,434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 146 parts In-Stock

1+ parts

$18.066

100+ parts

-

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-

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146

$18.066

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AZTECH Wire

Italy . 284 parts In-Stock

1+ parts

$20.710

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-

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284

$20.710

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Corohmni

South Africa . 1,078 parts In-Stock

1+ parts

$26.112

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-

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1,078

$26.112

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IDEA Electronic Components Group

UK . 513 parts In-Stock

1+ parts

$54.383

100+ parts

-

1k+ parts

$48.945

10k+ parts

-

513

$54.383

-

$48.945

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Component Stockers USA

USA . 436 parts In-Stock

1+ parts

$99.990

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-

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436

$99.990

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MKK Technologies

India . 2,054 parts In-Stock

1+ parts

$102.264

100+ parts

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2,054

$102.264

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DigiPath Technology Company

USA . 2,054 parts In-Stock

1+ parts

$102.264

100+ parts

-

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2,054

$102.264

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Kepictronics

USA . 5,978 parts In-Stock

1+ parts

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5,978

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A-Z Elektronik GmbH

Germany . 4,883 parts In-Stock

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4,883

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Parana Technologies

USA . 2,191 parts In-Stock

1+ parts

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100+ parts

$65.023

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2,191

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$65.023

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Corphita

USA . 1,868 parts In-Stock

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1,868

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Overview

Unlock unparalleled performance with the PSD854F2V-12MI from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile parallel I/O port is designed for a range of industrial applications, offering robust reliability and efficiency under diverse conditions. With its compact flatpack design and exceptional temperature tolerance, it ensures seamless integration into your projects, delivering superior value that empowers innovation and enhances operational excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

As a surface mount device, this product allows for efficient use of PCB space and simplifies the manufacturing process, making it suitable for high-density designs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V is compatible with a wide range of power supply options, providing flexibility in design.

Package Shape: SQUARE

The square shape optimizes space on the PCB, allowing for easier integration into compact electronic devices.

Power Supplies (V): 3.3

Operating at 3.3 V, this product is ideal for modern low-voltage applications, minimizing power consumption while maintaining performance.

No. of Terminals: 52

With 52 terminals, this device provides ample connectivity options, accommodating various configurations for enhanced functionality.

Package Style (Meter): FLATPACK

The flatpack style design helps in efficient thermal management and compact placement on circuit boards.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures compatibility with a broad range of battery-operated devices, enhancing versatility.

Maximum Operating Temperature: 85 °C

Rated for high temperatures up to 85 °C, this component is suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 °C makes this product ideal for use in extreme environments, ensuring reliability in challenging conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish enhances corrosion resistance and ensures a reliable electrical connection over time.

Ultraviolet Erasable: N

The lack of ultraviolet erasability suggests durability against destructive exposure, making it a good choice for long-term applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easier mounting and simplifies PCB layout, beneficial for high-performance circuits.

No. of Ports: 4

Offering four ports, this device allows for simultaneous connections, improving multitasking potential in control systems.

Maximum Seated Height: 2.35 mm

The low seated height enables design flexibility and is optimized for low-profile applications.

Width: 10 mm

At a compact width of 10 mm, this product can fit easily in space-constrained environments.

Length: 10 mm

The 10 mm length contributes to the overall compactness of the design, ideal for portable and embedded systems.

Temperature Grade: INDUSTRIAL

Industrial grade rating ensures robustness and reliability for demanding applications in harsh environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it offers flexibility and adaptability, suitable for various applications.

ROM Bits Size: 2097152 Bits

With a ROM size of 2,097,152 bits, that provides substantial data storage capability for applications that require a large amount of memory.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making it a suitable choice for modern electronic devices.

Terminal Form: GULL WING

The gull-wing terminal form provides excellent soldering performance and mechanical strength, ensuring reliable connections.

Nominal Supply Voltage: 3.3 V

Operating nominally at 3.3 V balances performance with energy efficiency, an ideal match for contemporary electronic circuits.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch maximizes PCB design efficiency, allowing for denser layouts without sacrificing reliability.

Maximum Standby Current: 0.0001 Amp

A maximum standby current of just 0.0001 A aids in energy savings, making the device suitable for power-sensitive applications.

Maximum Access Time: 0.00000012 ns

The extremely fast access time of 0.12 ns enables high-speed data transfer, essential for performance-critical applications.

No. of I/O Lines: 27

With 27 I/O lines, this product is versatile, supporting a wide variety of input/output operations, suitable for complex designs.

Technical Specifications

Parallel I/O Ports PSD854F2V-12MI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

2097152 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

PSD854F2V-12MI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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