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PSD854F2-90M

STMicroelectronics

PSD854F2-90M by STMicroelectronics

PSD854F2-90M by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design with a max temp of 70 °C and offers fast access times of just 90 ns. Ideal for general-purpose applications in commercial electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,355 parts In-Stock

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7,355

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Anansix

USA . 1,276 parts In-Stock

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1,276

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Digiode

USA . 1,046 parts In-Stock

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1,046

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First Choice Components Inc.

USA . 35 parts In-Stock

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35

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Distributors (Availability)

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AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$13.750

100+ parts

-

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525

$13.750

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Microchip USA

USA . 449 parts In-Stock

1+ parts

$14.769

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-

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449

$14.769

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IDEA Electronic Components Group

UK . 1,993 parts In-Stock

1+ parts

$53.373

100+ parts

-

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$48.036

10k+ parts

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1,993

$53.373

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$48.036

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Corohmni

South Africa . 694 parts In-Stock

1+ parts

$66.503

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694

$66.503

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MKK Technologies

India . 2,068 parts In-Stock

1+ parts

$100.364

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2,068

$100.364

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DigiPath Technology Company

USA . 2,068 parts In-Stock

1+ parts

$100.364

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2,068

$100.364

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Perfect Parts

USA . 6,005 parts In-Stock

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6,005

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,002 parts In-Stock

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4,002

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Parana Technologies

USA . 706 parts In-Stock

1+ parts

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$63.815

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706

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$63.815

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A-Z Elektronik GmbH

Germany . 197 parts In-Stock

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197

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Overview

Unlock the potential of your projects with the PSD854F2-90M from STMicroelectronics—where quality meets innovation! This versatile parallel I/O port offers unmatched reliability, ensuring seamless performance across numerous applications. With STMicroelectronics' renowned reputation for excellence, you can trust in its superior craftsmanship to enhance your designs. Elevate your electronics with this powerful component, making connectivity easier and more efficient than ever before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the product's longevity and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for compact circuit designs, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with common power sources, making it versatile for different designs.

Package Shape: SQUARE

The square shape aids in better layout management and efficient space utilization on PCBs.

Power Supplies (V): 5

A single supply voltage of 5V simplifies the power management circuitry, making it easier to integrate into designs.

No. of Terminals: 52

With 52 terminals, the product can support a wide range of functions and connectivity options, enhancing its flexibility.

Package Style (Meter): FLATPACK

Flatpack style helps in efficient cooling and reduces the overall height of the application, which is beneficial in low-profile designs.

Minimum Supply Voltage: 4.5 V

The wide range of supply voltage (4.5V to 5.5V) provides stability under varying load conditions, improving the reliability of the product.

Maximum Operating Temperature: 70 °C

Operational temperature of 70 °C makes this product suitable for a wide range of environments, ensuring performance in various applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can function in cooler environments, increasing its durability.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel-palladium-gold terminal finish provides excellent corrosion resistance and better electrical conductivity.

Ultraviolet Erasable: N

Being non-ultraviolet erasable reduces concerns for data retention, making it reliable for long-term applications.

Terminal Position: QUAD

Quad terminal positioning supports multiple connections in a compact area, optimizing PCB layout.

No. of Ports: 4

Four ports allow for concurrent data transfer, making it efficient for multi-device communication.

Maximum Seated Height: 2.35 mm

A low seated height facilitates easy integration into compact devices, maintaining a sleek design.

Width: 9.95 mm

The compact width is ideal for tight spaces, ensuring that it can be used in various applications without hindrance.

Length: 9.95 mm

The small length allows for dense circuit board layouts and minimizes the footprint of the overall design.

Temperature Grade: COMMERCIAL

Commercial grade suitability ensures it can perform reliably in a typical operating environment, making it a dependable choice for consumers.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it's versatile for a wide range of applications, accommodating various interfacing needs.

ROM Bits Size: 2097152 Bits

A large ROM bit size supports extensive data storage, beneficial for complex applications requiring significant memory.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making it energy-efficient and fast.

Terminal Form: GULL WING

Gull wing terminals simplify mounting and soldering processes, making assembly easier and more reliable.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard in many digital circuits, making integration straightforward for designers.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is suitable for dense packing on PCBs, allowing for more components in a limited area.

Maximum Standby Current: 0.0002 Amp

Low standby current minimizes energy consumption during idle states, extending battery life in portable applications.

Maximum Access Time: 0.00000009 ns

Extremely fast access time of 90 ns enhances data processing speed, boosting overall system performance.

No. of I/O Lines: 27

Having 27 I/O lines provides ample options for connecting to other components, ensuring flexible interfacing capabilities.

Technical Specifications

Parallel I/O Ports PSD854F2-90M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

9.95 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

2097152 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

9.95 mm

Peripheral IC Type:

Trade Compliance

PSD854F2-90M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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