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MAX7311AUG

NXP Semiconductors

MAX7311AUG by NXP Semiconductors

MAX7311AUG by NXP Semiconductors is a 16-bit parallel I/O port with a voltage range of 2-5.5V, ideal for automotive applications. It features a small outline package with 24 terminals and operates in temperatures ranging from -40 to 125°C. This BICMOS technology device is surface mountable and designed for various electronic control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MAX7311AUG by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,144 parts In-Stock

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5,144

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Anansix

USA . 2,511 parts In-Stock

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2,511

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Digiode

USA . 2,334 parts In-Stock

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2,334

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Semi Source

USA . 97 parts In-Stock

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97

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Prism Electronics

USA . 24 parts In-Stock

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24

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Distributors (Availability)

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Component Stockers USA

USA . 8,114 parts In-Stock

1+ parts

$4.740

100+ parts

$6.060

1k+ parts

$3.940

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8,114

$4.740

$6.060

$3.940

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Ampacity Inc.

Singapore . 767 parts In-Stock

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$12.000

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767

$12.000

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One Stop Electronics

USA . 2,337 parts In-Stock

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$26.000

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$26.000

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Semicontronic

India . 1,210 parts In-Stock

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$27.000

100+ parts

$26.325

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$26.190

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1,210

$27.000

$26.325

$26.190

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MARBEL Systems

Belgium . 3,005 parts In-Stock

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$35.212

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3,005

$35.212

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Corohmni

South Africa . 541 parts In-Stock

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$36.400

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541

$36.400

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Texas Native Microelectronics

USA . 2,637 parts In-Stock

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$40.473

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$35.616

2,637

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Kenton Components

USA . 643 parts In-Stock

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$48.568

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$42.739

643

$48.568

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$42.739

Qasali Group International

UK . 3,627 parts In-Stock

1+ parts

$109.277

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$96.164

3,627

$109.277

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$96.164

Corphita

USA . 4,531 parts In-Stock

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4,531

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UNI Independent Distributors

Spain . 4,096 parts In-Stock

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Argo Parts USA

USA . 3,732 parts In-Stock

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Kepictronics

USA . 2,204 parts In-Stock

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Continental Prestige Electronics

USA . 1,113 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of your designs with the MAX7311AUG by NXP Semiconductors. This versatile Parallel I/O Port offers high-quality performance and reliability, making it a top choice for various applications. With its innovative technology and automotive-grade temperature grade, this product provides unmatched value and benefits to customers looking for seamless integration and superior functionality. Upgrade your projects with the MAX7311AUG and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

The ability to be surface mounted allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 16

With 16 bits, this product offers high-speed parallel I/O capabilities, suitable for applications requiring data transfer of moderate complexity.

Power Supplies (V): 2/5.5

The wide range of power supply voltage (2V to 5.5V) allows for flexibility in various electronic systems, ensuring compatibility with different power sources.

No. of Terminals: 24

Having 24 terminals provides ample connection points for interfacing the product with other components, enhancing its versatility for different circuit designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes this product suitable for automotive environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand cold conditions, making it suitable for a wide range of applications.

Technology: BICMOS

Utilizing BICMOS technology enables high-performance, low-power consumption, and reliable operation, making this product efficient and dependable for various applications.

Terminal Form: GULL WING

The gull wing terminal form makes it easier to solder the product onto circuit boards, ensuring secure connections and reliable performance.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for high-density mounting, making this product suitable for compact electronic devices where space is limited.

Technical Specifications

Parallel I/O Ports MAX7311AUG attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

No. of Bits:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

MAX7311AUG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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