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PSD854F2-90JI

STMicroelectronics

PSD854F2-90JI by STMicroelectronics

PSD854F2-90JI by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 5.5V and operates in extreme temperatures from -40 °C to 85°C. It features 27 I/O lines and a compact chip carrier design, ideal for industrial applications. With a ROM size of 2M bits, it supports efficient data processing in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,290 parts In-Stock

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5,290

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Anansix

USA . 1,342 parts In-Stock

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1,342

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Digiode

USA . 772 parts In-Stock

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772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 60 parts In-Stock

1+ parts

$18.370

100+ parts

-

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60

$18.370

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Corohmni

South Africa . 2,062 parts In-Stock

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$21.786

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-

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2,062

$21.786

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IDEA Electronic Components Group

UK . 1,276 parts In-Stock

1+ parts

$40.008

100+ parts

-

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$36.007

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1,276

$40.008

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$36.007

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MKK Technologies

India . 631 parts In-Stock

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$75.233

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631

$75.233

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DigiPath Technology Company

USA . 631 parts In-Stock

1+ parts

$75.233

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631

$75.233

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Microchip USA

USA . 397 parts In-Stock

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$108.124

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397

$108.124

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Corphita

USA . 1,095 parts In-Stock

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1,095

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Parana Technologies

USA . 1,006 parts In-Stock

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$47.836

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1,006

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$47.836

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Overview

Unlock seamless connectivity and efficiency with the PSD854F2-90JI from STMicroelectronics! Renowned for its unmatched quality, STMicroelectronics delivers a robust solution tailored for diverse applications like industrial automation and consumer electronics. This versatile Parallel I/O Port enhances performance while ensuring reliability in demanding environments. Experience the benefits of superior power management and effortless integration—empowering your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures a robust package suitable for various applications, offering protection against environmental factors.

Surface Mount: YES

Surface mount technology enables compact designs and efficient use of board space, making it ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

The generous maximum supply voltage provides flexibility for power supply designs, accommodating a wide range of applications.

Package Shape: SQUARE

The square shape allows for efficient layout on PCBs, optimizing space and improving performance.

Power Supplies (V): 5

A standard power supply voltage simplifies integration into existing systems, promoting ease of design.

No. of Terminals: 52

With 52 terminals, this device provides ample connections for a variety of input/output configurations, enhancing versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier style facilitates easy handling and mounting, improving manufacturing efficiency.

Minimum Supply Voltage: 4.5 V

Operating at a minimum of 4.5 V ensures compatibility with low-voltage systems, broadening its application range.

Maximum Operating Temperature: 85 °C

Rated for high temperatures, this product can perform reliably in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures expands deployment options in extreme conditions, ensuring reliability.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance for long-term durability.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and reduces path lengths, improving performance overall.

No. of Ports: 4

Four ports enable multiple data streams, enhancing the device's ability to handle complex tasks efficiently.

Maximum Seated Height: 4.57 mm

A low seated height minimizes the footprint on PCBs, which is advantageous for space-constrained designs.

Width: 19.1 mm and Length: 19.1 mm

Compact dimensions make this product suitable for applications where space is at a premium.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this device is robust enough for harsh operating environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port makes this IC adaptable for a wide range of tasks in various applications.

ROM Bits Size: 2097152 Bits

A significant ROM bit size allows for complex applications and extensive data handling capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it energy-efficient and suitable for modern electronics.

Terminal Form: J BEND

J bend terminals facilitate easier soldering and connections, enhancing manufacturability.

Nominal Supply Voltage: 5 V

A nominal supply voltage that aligns with common digital systems simplifies integration and design processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between density and ease of handling, ensuring good reliability and performance.

Maximum Standby Current: 0.0002 Amp

Very low standby current consumption aids in power saving, making this product suitable for battery-operated devices.

Maximum Access Time: 0.00000009 ns

Extremely fast access time enhances data throughput, making this device ideal for speed-critical applications.

No. of I/O Lines: 27

With 27 I/O lines, this device provides significant connectivity options for interfacing with other components.

Technical Specifications

Parallel I/O Ports PSD854F2-90JI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

2097152 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD854F2-90JI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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