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PSD834F2V-15M

STMicroelectronics

PSD834F2V-15M by STMicroelectronics

PSD834F2V-15M by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines and operates at a nominal voltage of 3.3 V. It features a compact flatpack design, suitable for commercial applications up to 70 °C. Ideal for general-purpose interfacing in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,634 parts In-Stock

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Digiode

USA . 4,589 parts In-Stock

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Anansix

USA . 719 parts In-Stock

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Inventory MP

USA . 56 parts In-Stock

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Bristol Electronics

USA . 56 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 46 parts In-Stock

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$10.320

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IDEA Electronic Components Group

UK . 1,791 parts In-Stock

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$44.629

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$40.166

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Corohmni

South Africa . 4,987 parts In-Stock

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$50.653

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MKK Technologies

India . 1,150 parts In-Stock

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$83.922

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$83.922

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DigiPath Technology Company

USA . 1,150 parts In-Stock

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$83.922

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Component Stockers USA

USA . 493 parts In-Stock

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$99.990

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Corphita

USA . 1,237 parts In-Stock

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Parana Technologies

USA . 480 parts In-Stock

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$53.361

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Overview

Unlock unparalleled versatility with the PSD834F2V-15M from STMicroelectronics, a trusted pioneer in innovative semiconductor solutions. This high-performance parallel I/O port offers exceptional quality and reliability for your applications, ensuring seamless integration and optimal performance. Experience significant power efficiency and compact design, perfect for advanced electronic systems in consumer electronics, automotive, and industrial applications. Elevate your projects with cutting-edge technology that enhances functionality and drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the component suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, enhancing the efficiency of PCB layouts and reducing the space needed.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with various low-power applications while providing a safety margin.

Package Shape: SQUARE

The square shape assists in more efficient use of space on circuit boards, and simplifies placement in design.

Power Supplies (V): 3.3

Designed for a nominal supply of 3.3 V, this product aligns well with common digital systems and reduces power consumption.

No. of Terminals: 52

With 52 terminals, this I/O port offers a substantial number of connections needed for complex operations, ideal for advanced systems.

Package Style (Meter): FLATPACK

Flatpack packaging optimizes space and allows for better thermal management within the device.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures versatility in power supply options, accommodating a wider variety of design conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can function effectively in a range of environments without overheating.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C allows for its use in colder applications, further expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing long-term reliability.

Ultraviolet Erasable: N

Not being UV erasable simplifies the usage scenario as it eliminates the need for special protection from UV light.

Terminal Position: QUAD

Quad terminal positioning enhances routing capability on PCBs, allowing for easier connections and better performance.

No. of Ports: 4

With 4 ports, this component allows for simultaneous connections, enabling efficient parallel processing in applications.

Maximum Seated Height: 2.35 mm

A low seated height aids in compact device design, making it an excellent choice for space-constrained applications.

Width: 9.95 mm

Compact width makes this part suitable for miniaturized electronic projects, providing flexibility in design.

Length: 9.95 mm

A balanced length keeps the footprint small, ideal for efficient layouts in intricate electronics.

Temperature Grade: COMMERCIAL

Commercial-grade components are designed for high reliability in everyday applications and environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This versatility allows it to serve multiple roles in various applications, ensuring broad usability.

ROM Bits Size: 2359296 Bits

A sizable ROM supports complex programming needs, vast data handling capabilities, and flexible application requirements.

Technology: CMOS

CMOS technology offers low power consumption, making this part suitable for battery-operated devices and energy-efficient designs.

Terminal Form: GULL WING

The gull wing terminal design simplifies the soldering process while ensuring robust connections, ideal for high volume production.

Nominal Supply Voltage: 3.3 V

A stable voltage of 3.3 V supports operations in modern electronic systems, optimizing performance while keeping power consumption low.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for denser circuit design, making it suitable for compact applications.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current minimizes energy waste, making this component ideal for power-sensitive applications.

Maximum Access Time: 0.00000015 ns

This quick access time enhances data transfer speed, making it highly effective for fast-paced digital communication.

No. of I/O Lines: 27

With 27 I/O lines, it allows for substantial data handling and connectivity, supporting complex operational requirements.

Technical Specifications

Parallel I/O Ports PSD834F2V-15M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

9.95 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

2359296 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

9.95 mm

Peripheral IC Type:

Trade Compliance

PSD834F2V-15M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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