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PSD834F2-70M

STMicroelectronics

PSD834F2-70M by STMicroelectronics

PSD834F2-70M by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design with a max temp of 70 °C and offers fast access times of just 70 ns. Ideal for general-purpose applications in commercial electronics.

Median Price

$10.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 25 parts In-Stock

1+ parts

$10.500

100+ parts

$7.088

1k+ parts

$7.088

10k+ parts

$7.088

25

$10.500

$7.088

$7.088

$7.088

Vyrian

USA . 9,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,262

-

-

-

-

Anansix

USA . 2,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,721

-

-

-

-

Digiode

USA . 1,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,622

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 756 parts In-Stock

1+ parts

$19.650

100+ parts

-

1k+ parts

-

10k+ parts

-

756

$19.650

-

-

-

Microchip USA

USA . 332 parts In-Stock

1+ parts

$24.892

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$24.892

-

-

-

Corohmni

South Africa . 851 parts In-Stock

1+ parts

$60.980

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$60.980

-

-

-

IDEA Electronic Components Group

UK . 934 parts In-Stock

1+ parts

$67.464

100+ parts

-

1k+ parts

$60.717

10k+ parts

-

934

$67.464

-

$60.717

-

MKK Technologies

India . 377 parts In-Stock

1+ parts

$126.861

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$126.861

-

-

-

DigiPath Technology Company

USA . 377 parts In-Stock

1+ parts

$126.861

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$126.861

-

-

-

Kepictronics

USA . 9,232 parts In-Stock

1+ parts

-

100+ parts

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9,232

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-

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Corphita

USA . 3,693 parts In-Stock

1+ parts

-

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3,693

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-

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Parana Technologies

USA . 1,519 parts In-Stock

1+ parts

-

100+ parts

$80.663

1k+ parts

-

10k+ parts

-

1,519

-

$80.663

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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560

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Overview

Unlock superior performance with the PSD834F2-70M from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatile parallel I/O applications, this compact and reliable component ensures seamless integration into your projects while operating efficiently at low power. Trust in ST's commitment to quality and innovation, making it the ideal choice for enhancing your designs with speed, precision, and durability. Elevate your technology with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable construction, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology enables efficient use of circuit board space and allows for automated assembly, enhancing manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of systems running on 5V power supply.

Package Shape: SQUARE

The square shape aids in dense layout designs, optimizing the utilization of PCB space.

Power Supplies (V): 5

Designed to operate at a standard 5V supply, making it easy to integrate into existing systems without additional power supply considerations.

No. of Terminals: 52

With 52 terminals, this product offers extensive connectivity options, enabling it to support multiple functionalities.

Package Style (Meter): FLATPACK

The flatpack style is compatible with various mounting techniques and aids in heat dissipation.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for flexibility in power supply requirements, accommodating a range of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, it is suitable for commercial applications that may experience higher thermal loads.

Minimum Operating Temperature: 0 °C

Operational capability at 0 °C ensures reliability in colder environments, making it versatile across different climates.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and provides better corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning facilitates easier connections and better layout management on circuit boards.

No. of Ports: 4

Four ports allow for multiple parallel I/O operations, making it suitable for complex data handling applications.

Maximum Seated Height: 2.35 mm

A low seated height ensures compatibility with slim profile designs, optimizing the overall component arrangement.

Width: 9.95 mm

The compact width allows for more flexible PCB design and positioning in space-constrained environments.

Maximum Time At Peak Reflow Temperature: 30 s

The ability to withstand longer peak reflow times enhances compatibility with various soldering processes.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature supports advanced surface mount soldering techniques, ensuring strong connections.

Length: 9.95 mm

A compact length aids in effectively fitting into confined spaces on PCBs, enhancing design flexibility.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates solid performance in standard environmental conditions, ensuring reliability.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port makes this IC versatile, suitable for a variety of applications requiring parallel data transfer.

ROM Bits Size: 2359296 Bits

A large ROM bit size enhances storage capacity for data, allowing for efficient processing and transfer of complex information.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, making it energy-efficient and effective.

Terminal Form: GULL WING

Gull wing terminals provide excellent mounting stability and reliability, simplifying the assembly process.

Nominal Supply Voltage: 5 V

Operating at a nominal 5 V ensures compatibility with widespread consumer and industrial electronics.

Terminal Pitch: 0.65 mm

A smaller terminal pitch enables denser packing of components, maximizing the functional capabilities of the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 suggests moderate sensitivity to moisture, guiding best practices for handling and storage.

Maximum Standby Current: 0.0002 Amp

A low standby current indicates efficient energy use, making this device ideal for power-sensitive applications.

Maximum Access Time: 0.00000007 ns

Extremely fast access time supports high-speed data communications, enhancing overall system performance.

No. of I/O Lines: 27

With 27 I/O lines, this port supports extensive data transfer capabilities, making it suitable for applications requiring multiple data streams.

Technical Specifications

Parallel I/O Ports PSD834F2-70M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

9.95 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

2359296 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

9.95 mm

Peripheral IC Type:

Trade Compliance

PSD834F2-70M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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