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M93S56-WMN6T

STMicroelectronics

M93S56-WMN6T by STMicroelectronics

M93S56-WMN6T by STMicroelectronics is a 2048-bit EEPROM with 128x16 organization, operating at up to 2 MHz clock frequency. It features hardware/software write protection and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.

Median Price

$1.540

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 31 parts In-Stock

1+ parts

$1.540

100+ parts

$1.150

1k+ parts

$1.000

10k+ parts

-

31

$1.540

$1.150

$1.000

-

Vyrian

USA . 7,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,971

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-

-

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Digiode

USA . 4,722 parts In-Stock

1+ parts

-

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4,722

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J & M Industries LLC

USA . 2,470 parts In-Stock

1+ parts

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2,470

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Resion

USA . 2,366 parts In-Stock

1+ parts

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2,366

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Anansix

USA . 2,159 parts In-Stock

1+ parts

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2,159

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Semi Source

USA . 1,827 parts In-Stock

1+ parts

-

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1,827

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Bristol Electronics

USA . 672 parts In-Stock

1+ parts

-

100+ parts

-

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672

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Dan-Mar Components

USA . 672 parts In-Stock

1+ parts

-

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-

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672

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 250 parts In-Stock

1+ parts

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100+ parts

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250

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Sea View Technologies

USA . 20 parts In-Stock

1+ parts

-

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20

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Cogito LLC

Ukraine . 3 parts In-Stock

1+ parts

-

100+ parts

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 3,353 parts In-Stock

1+ parts

$0.140

100+ parts

$0.130

1k+ parts

$0.130

10k+ parts

-

3,353

$0.140

$0.130

$0.130

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IDEA Electronic Components Group

UK . 638 parts In-Stock

1+ parts

$2.853

100+ parts

-

1k+ parts

$2.568

10k+ parts

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638

$2.853

-

$2.568

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Microchip USA

USA . 206 parts In-Stock

1+ parts

$4.873

100+ parts

-

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206

$4.873

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MKK Technologies

India . 2,198 parts In-Stock

1+ parts

$5.365

100+ parts

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10k+ parts

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2,198

$5.365

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DigiPath Technology Company

USA . 2,198 parts In-Stock

1+ parts

$5.365

100+ parts

-

1k+ parts

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10k+ parts

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2,198

$5.365

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-

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$18.560

100+ parts

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460

$18.560

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Kepictronics

USA . 9,880 parts In-Stock

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9,880

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 1,918 parts In-Stock

1+ parts

-

100+ parts

$3.411

1k+ parts

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10k+ parts

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1,918

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$3.411

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A-Z Elektronik GmbH

Germany . 1,775 parts In-Stock

1+ parts

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100+ parts

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1,775

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Alle Elektronik GmbH

Germany . 1,183 parts In-Stock

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1,183

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Perfect Parts

USA . 879 parts In-Stock

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879

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Corphita

USA . 652 parts In-Stock

1+ parts

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652

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Overview

Unlock the power of reliable data storage with the M93S56-WMN6T by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality EEPROM chips that are perfect for a wide range of applications. From industrial automation to consumer electronics, this small outline package offers high performance and durability, ensuring your data is safe and secure. With features like hardware/software write protection and 1,000,000 write/erase cycles, you can trust that your information is always protected. Experience the value and peace of mind that STMicroelectronics brings to your projects with the M93S56-WMN6T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the EEPROM chip inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes it easier to integrate this EEPROM into various electronic devices, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

The synchronous operation mode allows for precise control and timing, making it suitable for applications where data synchronization is critical.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides stability and compatibility with standard electronic systems.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85 °C makes this EEPROM suitable for use in harsh environments or industrial applications.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection adds an extra layer of security to prevent accidental data loss or unauthorized access.

Maximum Clock Frequency (fCLK): 2 MHz

The high maximum clock frequency of 2 MHz allows for fast data transfer and efficient operation in time-sensitive applications.

Endurance: 1000000 Write/Erase Cycles

With a high endurance of 1,000,000 write/erase cycles, this EEPROM offers reliable performance and longevity for frequent data storage operations.

Technical Specifications

EEPROM M93S56-WMN6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M93S56-WMN6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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