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M74HCT08RM13TR

STMicroelectronics

M74HCT08RM13TR by STMicroelectronics

STMicroelectronics M74HCT08RM13TR is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage of 5V, offering a propagation delay of 32ns. Suitable for military-grade applications due to its nickel palladium gold finish and small outline package style.

Median Price

$0.487

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Pegasus Components GmbH

Germany . 20,000 parts In-Stock

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20,000

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Sogenti Electronics

Canada . 15,000 parts In-Stock

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Vyrian

USA . 5,470 parts In-Stock

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5,470

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Mil-Aero Solutions, Inc.

USA . 5,458 parts In-Stock

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5,458

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Anansix

USA . 2,838 parts In-Stock

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2,838

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Digiode

USA . 2,710 parts In-Stock

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2,710

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Zilex Electronics Inc.

Canada . 1,817 parts In-Stock

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1,817

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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1,000

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Bristol Electronics

USA . 680 parts In-Stock

1+ parts

-

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$0.487

1k+ parts

$0.240

10k+ parts

-

680

-

$0.487

$0.240

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Microfarads

USA . 656 parts In-Stock

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656

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EMSNET

USA . 39 parts In-Stock

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39

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Distributors (Availability)

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Microchip USA

USA . 211 parts In-Stock

1+ parts

$2.556

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211

$2.556

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IDEA Electronic Components Group

UK . 468 parts In-Stock

1+ parts

$14.179

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$12.761

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468

$14.179

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$12.761

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AZTECH Wire

Italy . 739 parts In-Stock

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$21.530

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739

$21.530

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MKK Technologies

India . 1,090 parts In-Stock

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$26.663

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1,090

$26.663

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DigiPath Technology Company

USA . 1,090 parts In-Stock

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$26.663

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$26.663

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Perfect Parts

USA . 11,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,696 parts In-Stock

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6,696

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Cyclops Electronics Ltd (Excess)

UK . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,464 parts In-Stock

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4,464

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 822 parts In-Stock

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$16.953

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822

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$16.953

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Corphita

USA . 723 parts In-Stock

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723

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Overview

Unlock the power of advanced logic gates with the M74HCT08RM13TR by STMicroelectronics. With a reputation for superior quality and reliability, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this versatile component delivers fast propagation delays and low power consumption, making it an ideal choice for any project. Trust STMicroelectronics to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the M74HCT08RM13TR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 32 ns

The low propagation delay ensures quick response times, making this product suitable for high-speed electronic circuits.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing manufacturing costs and improving reliability.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage makes this product compatible with a wide range of digital systems and easy to integrate into existing designs.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable performance in harsh environments and makes this product suitable for aerospace, defense, and other demanding applications.

Technical Specifications

Logic Gates M74HCT08RM13TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

M74HCT08RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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