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M74HC00TTR

STMicroelectronics

M74HC00TTR by STMicroelectronics

M74HC00TTR by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs, featuring a propagation delay of just 22 ns. It operates within a supply voltage range of 2-6 V and supports military-grade temperatures from -55 °C to 125°C. Ideal for compact electronic applications, it comes in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Ashlea Components Ltd

UK . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 3,255 parts In-Stock

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3,255

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Digiode

USA . 2,877 parts In-Stock

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2,877

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Anansix

USA . 2,656 parts In-Stock

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2,656

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Distributors (Availability)

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Microchip USA

USA . 237 parts In-Stock

1+ parts

$9.147

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237

$9.147

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IDEA Electronic Components Group

UK . 1,035 parts In-Stock

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$17.221

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-

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$15.499

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1,035

$17.221

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$15.499

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AZTECH Wire

Italy . 358 parts In-Stock

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$20.830

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358

$20.830

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$20.986

100+ parts

$19.097

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$17.209

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500

$20.986

$19.097

$17.209

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MKK Technologies

India . 1,572 parts In-Stock

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$32.384

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$32.384

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DigiPath Technology Company

USA . 1,572 parts In-Stock

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$32.384

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1,572

$32.384

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Component Stockers USA

USA . 313 parts In-Stock

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$99.990

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313

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Perfect Parts

USA . 42,925 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,044 parts In-Stock

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7,044

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Alle Elektronik GmbH

Germany . 4,696 parts In-Stock

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Corphita

USA . 2,575 parts In-Stock

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2,575

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Parana Technologies

USA . 2,148 parts In-Stock

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$20.591

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2,148

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$20.591

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Overview

Elevate your projects with the M74HC00TTR from STMicroelectronics—a benchmark in logic gate technology. Renowned for its reliability, STMicroelectronics ensures high-quality components that simplify design and enhance performance. With four versatile functions packed into a sleek, space-saving package, this robust chip is perfect for diverse applications, from consumer electronics to industrial automation. Experience faster response times, energy efficiency, and exceptional durability, all while benefiting from ST's expertise and commitment to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the logic gate reliable in various applications.

Propagation Delay At Nominal Supply: 22 ns

A low propagation delay indicates fast signal processing capabilities, enhancing the overall speed of circuit performance.

Surface Mount: YES

Surface mount technology allows for compact designs, facilitating easier integration into modern PCB layouts.

No. of Functions: 4

Having multiple functions within a single package conserves board space and reduces component count, simplifying design.

No. of Inputs: 2

The dual-input configuration enables versatile circuit design for various logic operations.

Package Shape: RECTANGULAR

The rectangular shape supports efficient layout and placement on PCBs, optimizing for space and connectivity.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal voltage of 4.5 V balances power consumption and performance, suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

A lower load capacitance allows for faster charging and discharging times, improving overall switching speed.

Power Supplies (V): 2/6

The support for a wide range of operating voltages (2V to 6V) provides flexibility for various applications.

No. of Terminals: 14

14 terminals allow for more interconnections, enhancing the complexity and functionality of circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style is ideal for space-constrained applications, promoting high-density designs.

Maximum I (ol): 4 Amp

This logic gate can drive higher loads, making it suitable for driving larger circuits without additional buffering.

Propagation Delay (tpd): 110 ns

While slightly higher than nominal, this propagation delay still ensures efficient operation in many timing-sensitive applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this component suitable for use in harsh environments.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures expands its applicability in extreme conditions, enhancing reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures excellent conductivity and corrosion resistance, enhancing durability and performance.

Terminal Position: DUAL

Dual terminal positioning offers flexibility for PCB layout and simplifies manufacturing.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a slimmer profile, crucial for compact device design.

Width: 4.4 mm

Narrow width allows for more efficient use of PCB real estate, supporting multi-function integration.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at low voltages promotes energy efficiency and reduces power consumption in battery-operated devices.

Length: 5 mm

Short length enhances design compactness, providing options for designing efficient circuit layouts.

Temperature Grade: MILITARY

Acknowledging military-grade specifications ensures robustness and reliability in demanding applications.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, making this logic gate suitable for modern electronics.

Terminal Form: GULL WING

Gull wing terminals enable easy wave soldering and rework, providing convenience in PCB assembly.

Packing Method: TR

Tape and reel packing facilitates automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is optimal for high-density applications, allowing for tighter layouts with minimal space.

Maximum Supply Voltage (Vsup): 6 V

With a maximum operating voltage of 6V, it supports a variety of power ranges, adding flexibility in design.

Technical Specifications

Logic Gates M74HC00TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC00TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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