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M74HC4075RM13TR

STMicroelectronics

M74HC4075RM13TR by STMicroelectronics

M74HC4075RM13TR by STMicroelectronics is a CMOS Logic Gates IC with 3 functions and inputs. It has a propagation delay of 24 ns at 4.5V, suitable for military-grade applications. This small outline package with nickel/palladium/gold terminals is surface mountable and operates b/w -55°C to 125°C.

Median Price

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Lifecycle Status

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Adafruit Industries

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Vyrian

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A2Z Electronics, Inc.

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Digiode

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

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Anansix

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Speed Components Ltd

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Nova Conductors

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Connector Distribution Corp

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Right Parts Inc.

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AZTECH Wire

Italy . 788 parts In-Stock

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$5.873

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Microchip USA

USA . 301 parts In-Stock

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$6.696

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Aztec Data Supply Inc.

USA . 308 parts In-Stock

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Corohmni

South Africa . 1,109 parts In-Stock

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IDEA Electronic Components Group

UK . 20 parts In-Stock

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Ampacity Inc.

Singapore . 401 parts In-Stock

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$33.000

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MKK Technologies

India . 825 parts In-Stock

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DigiPath Technology Company

USA . 825 parts In-Stock

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Continental Prestige Electronics

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Glotronic Ltd.

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Alle Elektronik GmbH

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Advanced Electronics

New Zealand . 750 parts In-Stock

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Parana Technologies

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Overview

Discover the ultimate solution for your logic gate needs with the M74HC4075RM13TR from STMicroelectronics. Renowned for their top-quality manufacturing, STMicroelectronics delivers excellence in every component they produce. This versatile logic gate is perfect for a variety of applications, providing fast propagation delays and low power consumption. With its compact design and reliable performance, this product offers exceptional value and benefits to customers looking for a high-quality solution for their electronic projects. Experience the difference with STMicroelectronics and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it a good choice for portable electronic devices.

Propagation Delay At Nominal Supply: 24 ns

With a fast propagation delay of 24 ns, this logic gate provides quick response times, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient PCB assembly, making this product suitable for mass production.

No. of Functions: 3

This logic gate combines three functions in one package, saving space and reducing component count in circuit designs.

No. of Inputs: 3

With three inputs, this logic gate offers more flexibility in signal processing, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it a practical choice for compact designs.

Nominal Supply Voltage / Vsup: 4.5V

This logic gate operates at a nominal supply voltage of 4.5V, which is commonly used in many electronic systems, making it a versatile choice.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate can drive capacitive loads effectively, ensuring signal integrity in complex circuits.

Power Supplies (V): 2/6

This logic gate is compatible with power supplies ranging from 2V to 6V, offering flexibility in voltage requirements for different applications.

No. of Terminals: 14

With 14 terminals, this logic gate provides ample connectivity options for interfacing with other components, making it suitable for complex circuit designs.

Technical Specifications

Logic Gates M74HC4075RM13TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

M74HC4075RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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