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M74HC132RM13TR

STMicroelectronics

M74HC132RM13TR by STMicroelectronics

STMicroelectronics M74HC132RM13TR is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 32 ns at 4.5V, suitable for military-grade applications. This surface-mount device in a small outline package operates b/w -55 to 125°C, making it ideal for high-temperature environments.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

18

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1k+

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Tomark Electronics Ltd

UK . 2,000 parts In-Stock

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$0.090

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ComSIT Distribution GmbH

Germany . 19,564 parts In-Stock

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Vyrian

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Tectiva GmbH

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Component Sense

UK . 4,500 parts In-Stock

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$0.130

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$0.130

Odintec Ltd.

Israel . 2,500 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 2,247 parts In-Stock

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Ashlea Components Ltd

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Anansix

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Rebound Electronics

UK . 1,750 parts In-Stock

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Euro-Tech

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J2 Sourcing AB

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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LWI Electronics Inc

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Ampacity Inc.

Singapore . 708 parts In-Stock

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$18.000

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AZTECH Wire

Italy . 830 parts In-Stock

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$18.853

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Corohmni

South Africa . 898 parts In-Stock

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IDEA Electronic Components Group

UK . 312 parts In-Stock

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Aztec Data Supply Inc.

USA . 261 parts In-Stock

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$32.256

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MKK Technologies

India . 1,952 parts In-Stock

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DigiPath Technology Company

USA . 1,952 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Metaverse IC Inc.

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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Parana Technologies

USA . 1,583 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Elevate your electronic designs with the M74HC132RM13TR by STMicroelectronics, a top-tier manufacturer known for quality and reliability. As a Logic Gates component, this product offers unmatched performance in various applications. With a fast propagation delay and low power consumption, this logic gate ensures efficient operation. Its small outline package and surface-mount capability make it ideal for space-constrained designs. Trust STMicroelectronics to deliver superior products that meet your needs, providing value and innovation every step of the way. Upgrade your projects with the M74HC132RM13TR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making this product a reliable choice for various applications.

Propagation Delay At Nominal Supply: 32 ns

The low propagation delay of 32 ns ensures fast response time, making this logic gate suitable for applications requiring quick signal processing.

Surface Mount: YES

Being surface mountable makes this logic gate easy to integrate into PCB designs, saving space and simplifying assembly processes.

No. of Functions: 4

With 4 functions in one package, this logic gate offers versatility and flexibility in circuit design, allowing for complex logic operations.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, making this product suitable for simple circuit designs.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for the logic gate to operate effectively within its specified range.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures minimal signal distortion and efficient signal transmission, contributing to reliable performance.

Power Supplies (V): 2/6

The dual power supply compatibility with voltages of 2V and 6V offers flexibility in voltage requirements for different applications, enhancing versatility.

No. of Terminals: 14

With 14 terminals for connections, this logic gate provides ample interface options for integrating it into various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making this logic gate suitable for compact designs where board real estate is limited.

Maximum I (ol): 4 Amp

The high maximum output current of 4A allows this logic gate to drive larger loads without overheating or voltage drop, ensuring robust performance.

Propagation Delay (tpd): 160 ns

Although not the lowest, a propagation delay of 160 ns still ensures relatively fast signal processing, making this product suitable for many applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this logic gate can withstand elevated temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows this logic gate to function in cold conditions, expanding its range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish ensures good conductivity, corrosion resistance, and long-term reliability for the connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options and allows for easier PCB layout, improving overall design efficiency.

Maximum Seated Height: 1.75 mm

With a low maximum seated height of 1.75mm, this logic gate is suitable for slim and compact electronic devices where space is constrained.

Width: 3.9 mm

The narrow width of 3.9mm contributes to space-saving on the PCB and enables denser packing of components, ideal for designs with limited space.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement of 2V allows this logic gate to operate in low-power applications and with various power sources.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40s at peak temperature, this logic gate is easy to solder to the PCB, reducing assembly time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering without damaging the components, making this product suitable for lead-free processes.

Length: 8.65 mm

The compact length of 8.65mm contributes to the overall small form factor of this logic gate, ideal for applications where space is limited.

Temperature Grade: MILITARY

The military-grade temperature rating indicates robustness and reliability, making this logic gate suitable for demanding environments and critical applications.

Schmitt Trigger: YES

The presence of a Schmitt trigger ensures noise immunity and stable input signal detection, enhancing the overall performance and reliability of this logic gate.

Technology: CMOS

The CMOS technology used in this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making it efficient and versatile.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and inspection processes, making assembly and maintenance of the logic gate more convenient and reliable.

Packing Method: TR

The TR (tape and reel) packing method enables automated pick-and-place assembly, reducing manual handling and improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm allows for compatibility with common PCB layouts and components, ensuring easy integration into existing designs.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6V provides flexibility for use in applications requiring higher voltage levels, enhancing the versatility of this logic gate.

Technical Specifications

Logic Gates M74HC132RM13TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

160 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

M74HC132RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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