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M74HCT00B1R

STMicroelectronics

M74HCT00B1R by STMicroelectronics

M74HCT00B1R by STMicroelectronics is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage of 5V, has a propagation delay of 29ns, and can handle load capacitance up to 50pF. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.067

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.067

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150

$0.067

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Digiode

USA . 2,619 parts In-Stock

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2,619

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Lantek

USA . 2,500 parts In-Stock

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Vyrian

USA . 2,187 parts In-Stock

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Anansix

USA . 2,095 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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Distributors (Availability)

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Argo Parts USA

USA . 2,622 parts In-Stock

1+ parts

$0.067

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$0.065

2,622

$0.067

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-

$0.065

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.067

100+ parts

-

1k+ parts

$0.064

10k+ parts

$0.062

1,000

$0.067

-

$0.064

$0.062

Continental Prestige Electronics

USA . 726 parts In-Stock

1+ parts

$0.067

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$0.066

726

$0.067

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$0.066

Benley Electronics

USA . 3 parts In-Stock

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$1.750

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3

$1.750

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Microchip USA

USA . 222 parts In-Stock

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$3.598

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AZTECH Wire

Italy . 444 parts In-Stock

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$12.057

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$12.057

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Aztec Data Supply Inc.

USA . 4,890 parts In-Stock

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$15.720

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$15.720

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Corohmni

South Africa . 26 parts In-Stock

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$18.113

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IDEA Electronic Components Group

UK . 2,161 parts In-Stock

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$25.105

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$22.594

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Ampacity Inc.

Singapore . 750 parts In-Stock

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$28.000

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$28.000

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MKK Technologies

India . 1,632 parts In-Stock

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$47.208

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DigiPath Technology Company

USA . 1,632 parts In-Stock

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$47.208

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Authorized Procurement Solutions

USA . 50,514 parts In-Stock

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Corphita

USA . 3,890 parts In-Stock

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Parana Technologies

USA . 1,680 parts In-Stock

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$30.017

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1,680

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$30.017

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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Amble Industries

USA . 10 parts In-Stock

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Overview

Unlock the power of advanced logic gates with the M74HCT00B1R from STMicroelectronics. This high-quality product offers unmatched reliability and performance, making it the ideal choice for a wide range of applications. With its durable plastic/epoxy package body material and military-grade temperature grade, this logic gate ensures seamless operation even in the most demanding environments. Trust STMicroelectronics to deliver technology that exceeds expectations, providing you with the value and benefits you deserve. Elevate your projects with the M74HCT00B1R and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 29 ns

The low propagation delay ensures that signals are processed quickly, improving the overall performance of the product.

No. of Inputs: 2

Having 2 inputs allows for more flexibility in logic operations, making the product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

The standardized supply voltage of 5V ensures compatibility with other components, making integration easier.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to be used in a wide range of environments without risk of overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in operation.

Technical Specifications

Logic Gates M74HCT00B1R attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

29 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HCT00B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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