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M74HC02TTR

STMicroelectronics

M74HC02TTR by STMicroelectronics

M74HC02TTR from STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs, featuring a propagation delay of just 22 ns. It operates b/w 2V to 6V and supports military-grade temperatures from -55 °C to 125°C. Ideal for compact electronic applications, it comes in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,329 parts In-Stock

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Digiode

USA . 2,496 parts In-Stock

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2,496

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Anansix

USA . 1,597 parts In-Stock

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1,597

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Microchip USA

USA . 474 parts In-Stock

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$2.594

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474

$2.594

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AZTECH Wire

Italy . 778 parts In-Stock

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$12.850

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778

$12.850

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

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$18.356

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$16.520

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2,297

$18.356

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$16.520

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MKK Technologies

India . 265 parts In-Stock

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$34.517

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265

$34.517

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DigiPath Technology Company

USA . 265 parts In-Stock

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$34.517

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265

$34.517

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QUARKTWIN TECHNOLOGY LTD

USA . 28,942 parts In-Stock

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Corphita

USA . 1,844 parts In-Stock

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Parana Technologies

USA . 1,746 parts In-Stock

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$21.947

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Overview

Elevate your design with the M74HC02TTR from STMicroelectronics, a leader in quality and innovation. This versatile logic gate offers reliability and efficiency for diverse applications, from consumer electronics to industrial automation. With its robust performance and compact form factor, it enables seamless integration into your projects. Trust in STMicroelectronics’ commitment to excellence and enjoy enhanced functionality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures lightweight construction and durability, making it suitable for various applications.

Propagation Delay At Nominal Supply: 22 ns

A low propagation delay of 22 ns indicates high-speed performance, making this product ideal for fast-switching applications.

Surface Mount: YES

Surface mount compatibility allows for compact designs and automated assembly processes, enhancing overall production efficiency.

No. of Functions: 4

Having four functions means this logic gate provides versatility, allowing it to handle multiple logic operations in a single package.

No. of Inputs: 2

With two inputs, this product allows for simple logic gate designs, which are fundamental in digital circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package facilitates efficient space utilization on PCB layouts.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V allows for compatibility with standard voltage levels in digital systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF supports a wide range of applications while ensuring reliable operation in digital circuits.

Power Supplies (V): 2/6

Support for a power supply range of 2V to 6V provides flexibility in various electronic designs.

No. of Terminals: 14

With 14 terminals, this chip can connect easily with other components, facilitating complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for reduced board space requirements, making it suitable for compact electronic devices.

Maximum I (ol): 4 Amp

A high output current capability of 4 Amp enables this product to drive larger loads effectively, increasing its application range.

Propagation Delay (tpd): 110 ns

Although this propagation delay is longer than the nominal value, it allows for robust performance in more complex circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for use in demanding environments without performance degradation.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature ensures reliable performance in extreme cold, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances connectivity, improving electrical performance and longevity in harsh conditions.

Terminal Position: DUAL

Dual terminal positioning provides flexibility for circuit layout and design, helping ensure reliable connectivity.

Maximum Seated Height: 1.2 mm

A low maximum seated height allows for compatibility with low-profile applications, ideal for modern compact designs.

Width: 4.4 mm

A width of 4.4 mm makes this component compact, facilitating space-constrained designs.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum supply voltage of 2V enhances compatibility with a variety of lower voltage applications.

Length: 5 mm

A compact length of 5 mm contributes to a smaller footprint on circuit boards, important for space-saving designs.

Temperature Grade: MILITARY

Being graded for military use indicates high reliability and performance in extreme environments, suitable for critical applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high-speed operation, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer excellent soldering characteristics, aiding in effective assembly and reducing mechanical stress.

Packing Method: TR

The tape and reel packing method allows for automated assembly and efficient handling during manufacturing.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is conducive to densely packed designs, optimizing PCB space usage.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this component can operate efficiently under various voltage conditions in different applications.

Technical Specifications

Logic Gates M74HC02TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC02TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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