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M74HC74RM13TR

STMicroelectronics

M74HC74RM13TR by STMicroelectronics

M74HC74RM13TR by STMicroelectronics is a dual positive edge-triggered flip-flop in a compact 14-terminal SO package. It operates b/w 2-6V, with a max frequency of 21MHz and propagation delay of 225ns, ideal for high-speed digital applications. Its robust design supports military-grade temperatures from -55 °C to 125 °C.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1,575 parts In-Stock

1+ parts

$0.229

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$0.240

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$0.226

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-

1,575

$0.229

$0.240

$0.226

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TEDSS.com

USA . 690 parts In-Stock

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$0.500

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$0.270

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690

$0.500

$0.270

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Component Electronics Inc.

Canada . 340 parts In-Stock

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$0.960

100+ parts

$0.720

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$0.630

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340

$0.960

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$0.630

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ComSIT Distribution GmbH

Germany . 19,480 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9,800 parts In-Stock

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Vyrian

USA . 6,235 parts In-Stock

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6,235

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Pegasus Components GmbH

Germany . 5,000 parts In-Stock

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Martec Srl

Italy . 3,927 parts In-Stock

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Magnum Semiconductors LLP

India . 3,800 parts In-Stock

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3,800

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J2 Sourcing AB

Sweden . 2,500 parts In-Stock

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2,500

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LIBRA Elektronik GmbH

Germany . 2,498 parts In-Stock

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2,498

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Odi Ramu Company

Canada . 2,374 parts In-Stock

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Anansix

USA . 1,389 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 609 parts In-Stock

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609

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Digiode

USA . 395 parts In-Stock

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395

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Sensible Micro Corp

USA . 250 parts In-Stock

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$0.175

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$0.162

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250

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$0.175

$0.162

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Contempo Components LLC

USA . 37 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$13.370

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400

$13.370

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IDEA Electronic Components Group

UK . 1,642 parts In-Stock

1+ parts

$14.161

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$12.745

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1,642

$14.161

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$12.745

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MKK Technologies

India . 101 parts In-Stock

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$26.628

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101

$26.628

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DigiPath Technology Company

USA . 101 parts In-Stock

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$26.628

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101

$26.628

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Metaverse IC Inc.

Canada . 52,512 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,215 parts In-Stock

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Perfect Parts

USA . 21,995 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 9,800 parts In-Stock

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9,800

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A-Z Elektronik GmbH

Germany . 5,837 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,325 parts In-Stock

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Corphita

USA . 3,944 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,891 parts In-Stock

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Parana Technologies

USA . 1,993 parts In-Stock

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$16.931

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$16.931

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Infinite Electronics LLP (Excess)

. 1,002 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Component Stockers USA

USA . 207 parts In-Stock

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Authorized Procurement Solutions

USA . 191 parts In-Stock

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191

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Technoshack Inc. (Excess)

Canada . 69 parts In-Stock

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Overview

Unlock the potential of your designs with the M74HC74RM13TR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This reliable flip-flop enhances performance and efficiency in a variety of applications, from consumer electronics to industrial automation. Its compact surface-mount design ensures seamless integration, while exceptional reliability at extreme temperatures guarantees longevity. Experience unmatched value and peace of mind with ST's commitment to innovation and quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits.

No. of Functions: 2

Having two functions enables flexible design options and can help save board space in applications.

Package Shape: RECTANGULAR

The rectangular shape offers efficient use of space on the PCB, optimizing layout and component positioning.

Nominal Supply Voltage / Vsup: 4.5 V

Operating at a nominal supply voltage of 4.5 V ensures compatibility with a wide range of power sources, enhancing versatility.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates low power consumption and fast switching speeds, ideal for high-speed applications.

Power Supplies (V): 2/6

Supports a range of supply voltages (2V to 6V), making it adaptable for different circuit requirements.

No. of Terminals: 14

With 14 terminals, this product offers extensive connectivity options for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space on PCBs, which is critical for compact electronic devices.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps ensures it can drive loads efficiently, making it suitable for various applications.

Propagation Delay (tpd): 225 ns

Fast propagation delay of 225 ns facilitates quick signal processing, crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range of up to 125 °C allows usage in extreme environments, enhancing reliability.

Trigger Type: POSITIVE EDGE

The positive edge trigger offers precise timing control, essential for synchronous digital circuits.

Minimum Operating Temperature: -55 °C

Operating down to -55 °C makes this product suitable for harsh environments, such as automotive and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish improves electrical conductivity and prevents oxidation, ensuring reliable long-term performance.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility and design options for manufacturers.

Maximum Seated Height: 1.75 mm

A low seated height allows for more compact designs, essential for modern miniature devices.

Width: 3.9 mm

A narrow width specification helps save precious real estate on circuit boards while maintaining performance.

Output Polarity: COMPLEMENTARY

Complementary output polarity improves circuit versatility and supports various logical configurations.

Minimum Supply Voltage (Vsup): 2 V

Starting at 2 V increases compatibility with low power and battery-operated devices.

Maximum Time At Peak Reflow Temperature: 40 s

40 seconds at peak reflow temperature allows for effective soldering without damaging the device.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is ideal for reliable surface mounting in automated assembly processes.

Length: 8.65 mm

Compact length ensures that it fits well in tight spaces, catering to high-density PCB layouts.

Temperature Grade: MILITARY

Military-grade temperature classification ensures reliability in extreme conditions, suitable for defense applications.

Maximum Frequency At Nominal Supply: 21 MHz

A maximum frequency of 21 MHz allows for efficient data processing in various applications, enhancing performance.

Technology: CMOS

CMOS technology is renowned for low power consumption and high noise immunity, ensuring efficient operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure a strong mechanical bond, which improves reliability.

Packing Method: TR

Tape and reel packaging ensures safe handling and ease of automation during manufacturing processes.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is compatible with most standard PCB designs, making it easy to integrate.

Minimum fmax: 25 MHz

Supports a minimum frequency of 25 MHz ensures that it can handle base-level data processing needs effectively.

Maximum Supply Voltage (Vsup): 6 V

Operating up to 6 V provides flexibility for various circuit designs and performance needs.

Technical Specifications

Latches & Flip-Flops M74HC74RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

25 MHz

Trade Compliance

M74HC74RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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