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M74HC109RM13TR

STMicroelectronics

M74HC109RM13TR by STMicroelectronics

M74HC109RM13TR by STMicroelectronics is a dual 2-bit CMOS latch with a max supply voltage of 6V and operates at temperatures from -55 °C to 125 °C. It features a propagation delay of 225 ns and supports frequencies up to 21 MHz. Ideal for military applications, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,844 parts In-Stock

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Digiode

USA . 3,247 parts In-Stock

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3,247

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Anansix

USA . 1,184 parts In-Stock

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1,184

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

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$14.258

100+ parts

-

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$12.832

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2,378

$14.258

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$12.832

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AZTECH Wire

Italy . 840 parts In-Stock

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$19.030

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840

$19.030

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MKK Technologies

India . 900 parts In-Stock

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$26.812

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900

$26.812

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DigiPath Technology Company

USA . 900 parts In-Stock

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$26.812

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900

$26.812

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Microchip USA

USA . 3,918 parts In-Stock

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3,918

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,094 parts In-Stock

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Parana Technologies

USA . 881 parts In-Stock

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$17.048

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881

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$17.048

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Overview

Unlock the power of precision with the M74HC109RM13TR from STMicroelectronics! This high-quality dual flip-flop is designed for reliability and performance in demanding applications, making it perfect for everything from automotive systems to industrial controls. With ST's commitment to excellence, customers benefit from enhanced durability, efficient operation, and seamless integration into their designs. Elevate your projects with a component that delivers exceptional value and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, enabling versatile integration into modern electronic devices.

No. of Functions: 2

Offering two functions enhances design flexibility, allowing for more complex operations in a single package.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient space usage and facilitates better layout options on circuit boards.

No. of Bits: 2

With two bits, this product can handle more data and control signals, making it suitable for various digital applications.

Nominal Supply Voltage / Vsup: 4.5 V

A nominal supply voltage of 4.5 V is optimal for many digital systems, ensuring reliable performance and stability.

Load Capacitance (CL): 50 pF

Low load capacitance allows for faster switching speeds and reduced power consumption, improving overall system efficiency.

Power Supplies (V): 2/6 V

This wide range of power supply voltage options makes the product adaptable to different application needs.

No. of Terminals: 16

A higher number of terminals enhances connectivity and functional integration in a compact space.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in space-saving designs, ideal for modern compact electronic devices.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps provides strong drive capability for external loads, making it suitable for high-performance applications.

Propagation Delay (tpd): 225 ns

A fast propagation delay ensures high-speed operation, making this latch/flip-flop ideal for time-sensitive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can function reliably in extreme environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering is beneficial for synchronous circuit designs, providing high precision in timing operations.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for use in harsh and cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning facilitates versatile mounting options and easier layout in PCB designs.

Maximum Seated Height: 1.75 mm

A low profile (1.75 mm) ensures compatibility with space-constrained applications while maintaining the performance.

Width: 3.9 mm

A narrow width design (3.9 mm) allows for efficient use of PCB space, promoting compact designs.

Output Polarity: COMPLEMENTARY

Complementary output polarity enables flexible circuit designs and enhances functionality for various applications.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage makes it compatible with low-power applications, contributing to overall energy efficiency.

Length: 9.9 mm

The compact length enhances design flexibility and promotes integration into smaller electronic systems.

Temperature Grade: MILITARY

The military-grade specification ensures high reliability and performance under challenging conditions, suitable for defense applications.

Maximum Frequency At Nominal Supply: 21,000,000 Hz

A high maximum frequency at nominal supply allows for rapid data processing and high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and assembly, improving manufacturing efficiency.

Packing Method: TR

The Tape and Reel (TR) packing method simplifies automated assembly processes, reducing handling time during production.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm promotes compatibility with various layout designs, providing versatility in applications.

Minimum fmax: 25 MHz

The minimum frequency capability of 25 MHz supports a variety of digital functions, suitable for everyday electronic tasks.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates a moderate level of handling precautions, suitable for production environments.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6 V allows for compatibility with a wide range of electronic components and systems.

Technical Specifications

Latches & Flip-Flops M74HC109RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

25 MHz

Trade Compliance

M74HC109RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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