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M74HC109TTR

STMicroelectronics

M74HC109TTR by STMicroelectronics

M74HC109TTR by STMicroelectronics is a dual positive edge-triggered flip-flop with a max frequency of 21 MHz and operates b/w 2-6 V. It features a low propagation delay of 225 ns and supports up to 4 A output current. Ideal for high-speed digital applications, it comes in a compact SOIC package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,846 parts In-Stock

1+ parts

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4,846

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Vyrian

USA . 2,638 parts In-Stock

1+ parts

-

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1k+ parts

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2,638

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Anansix

USA . 1,535 parts In-Stock

1+ parts

-

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1,535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,797 parts In-Stock

1+ parts

$27.342

100+ parts

-

1k+ parts

$24.608

10k+ parts

-

1,797

$27.342

-

$24.608

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MKK Technologies

India . 207 parts In-Stock

1+ parts

$51.416

100+ parts

-

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10k+ parts

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207

$51.416

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DigiPath Technology Company

USA . 207 parts In-Stock

1+ parts

$51.416

100+ parts

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10k+ parts

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207

$51.416

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-

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Corphita

USA . 4,164 parts In-Stock

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4,164

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Parana Technologies

USA . 361 parts In-Stock

1+ parts

-

100+ parts

$32.692

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361

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$32.692

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Overview

Elevate your designs with the M74HC109TTR from STMicroelectronics, a paragon of reliability in latches and flip-flops. Crafted with precision, this high-performance component excels in diverse applications—from consumer electronics to industrial automation—ensuring seamless operation even under extreme conditions. With ST's commitment to quality and cutting-edge technology, experience enhanced efficiency and longevity, empowering your projects with unmatched performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection of the latch and flip-flop circuitry.

Surface Mount: YES

Surface mount technology allows for compact designs, making the product suitable for space-constrained applications.

No. of Functions: 2

Offering two functions increases versatility and can reduce the number of components needed in a circuit.

Package Shape: RECTANGULAR

The rectangular package shape is standard, allowing for easy integration into various PCB layouts.

No. of Bits: 2

With 2 bits, this device can handle modest data throughput, making it great for simple digital logic implementations.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5V indicates efficiency and compatibility with a range of common power supplies.

Load Capacitance (CL): 50 pF

Low load capacitance allows for faster switching speeds, improving overall circuit performance.

Power Supplies (V): 2/6

The dual power supply range offers flexibility in various applications, accommodating different system voltages.

No. of Terminals: 16

With 16 terminals, this component can connect to multiple external devices, enhancing functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and reduced pitch allow for high-density circuit design, perfect for modern electronics.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps means it can drive heavier loads efficiently, suitable for high-power applications.

Propagation Delay (tpd): 225 ns

A short propagation delay enhances performance in high-speed applications, facilitating quicker signal response times.

Maximum Operating Temperature: 125 °C

High thermal tolerance allows the component to function reliably in harsh conditions, making it military-grade.

Trigger Type: POSITIVE EDGE

The positive edge triggering is standard for digital circuits, providing reliable switching for data processing.

Minimum Operating Temperature: -55 °C

The capability to operate at -55 °C makes this product suitable for extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures minimal contact resistance and enhanced durability, ensuring longevity.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, accommodating diverse PCB designs.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact design, essential for modern electronics with space constraints.

Width: 4.4 mm

A narrow width allows for a slim profile that fits well into tight spaces in PCB layouts.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides a versatile signal output necessary for various digital logic applications.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a low supply voltage makes this product energy-efficient and suitable for battery-powered applications.

Length: 5 mm

Compact length supports space-efficient designs, ideal for both consumer and industrial electronics.

Temperature Grade: MILITARY

Designed to military specifications, this product ensures reliability and performance in critical applications.

Maximum Frequency At Nominal Supply: 21000000 Hz

High maximum frequency capability supports fast data processing, enhancing overall system performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it an excellent choice for low-energy designs.

Terminal Form: GULL WING

Gull wing terminals provide good solderability and alignment, facilitating reliable connections on PCBs.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for denser component placement on PCBs, optimizing space and layout.

Minimum fmax: 25 MHz

A minimum frequency capability of 25 MHz supports a wide range of digital applications, ensuring performance.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates moderate moisture sensitivity, making proper handling and storage essential for maintaining performance.

Maximum Supply Voltage (Vsup): 6 V

The capability to handle up to 6V supply voltage makes this product flexible for various electrical environments.

Technical Specifications

Latches & Flip-Flops M74HC109TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

M74HC109TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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