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M74HC109M1

STMicroelectronics

M74HC109M1 by STMicroelectronics

M74HC109M1 by STMicroelectronics is a dual-function latch with 2 bits, operating at 5V. It has a propagation delay of 41ns and can handle load capacitance up to 50pF. Ideal for industrial applications requiring positive edge triggering, this CMOS technology flip-flop comes in a small outline package with surface mount capability.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,851 parts In-Stock

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Digiode

USA . 2,371 parts In-Stock

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2,371

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Anansix

USA . 187 parts In-Stock

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187

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 109 parts In-Stock

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$29.345

100+ parts

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1k+ parts

$26.411

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109

$29.345

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$26.411

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MKK Technologies

India . 1,647 parts In-Stock

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$55.182

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1,647

$55.182

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DigiPath Technology Company

USA . 1,647 parts In-Stock

1+ parts

$55.182

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1,647

$55.182

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Corphita

USA . 2,845 parts In-Stock

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2,845

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Parana Technologies

USA . 1,472 parts In-Stock

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$35.087

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1,472

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$35.087

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Overview

Unlock the power of innovation with the M74HC109M1 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality latches & flip-flops designed to meet your needs. With a nominal supply voltage of 5V and a maximum frequency of 24MHz, this product offers unparalleled performance and reliability. Whether you're working on industrial applications or high-speed designs, the M74HC109M1 provides the value, benefits, and advantages you need to take your projects to the next level. Elevate your technology with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the latch or flip-flop easy to handle and integrate into electronic devices.

Surface Mount: YES

Surface mount capability allows for easy installation onto circuit boards, saving time and effort in assembly.

No. of Functions: 2

Having 2 functions in one component offers increased functionality and versatility in circuit design.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to integrate into circuit layouts.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with many electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and reliable operation in a variety of applications.

Power Supplies (V): 2/6

Supports power supplies ranging from 2V to 6V, providing flexibility in voltage requirements.

No. of Terminals: 16

Having 16 terminals allows for a greater number of connections and functionality in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards, ideal for compact electronic devices.

Maximum I (ol): 4 Amp

High maximum output current capability allows for driving larger loads without external amplification.

Propagation Delay (tpd): 41 ns

Low propagation delay ensures fast response time and high-speed operation in digital circuits.

Maximum Operating Temperature: 85 °C

Wide operating temperature range up to 85 °C ensures reliable performance in various environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures accurate timing and synchronization in digital signal processing.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40 °C allows for operation in extreme cold conditions without compromising performance.

Terminal Finish: TIN LEAD

TIN lead terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connectivity options on circuit boards.

Maximum Seated Height: 1.75 mm

Low profile design with a maximum seated height of 1.75mm saves space and allows for compact device designs.

Width: 3.9 mm

Narrow width of 3.9mm makes it suitable for applications with limited space constraints.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides balanced signal levels and enhances noise immunity in digital circuits.

Minimum Supply Voltage (Vsup): 2 V

Supports a minimum supply voltage of 2V, ensuring compatibility with low voltage electronic systems.

Length: 9.9 mm

Length of 9.9mm offers a compact footprint, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Maximum Frequency At Nominal Supply: 24000000 Hz

Supports high-frequency operation up to 24MHz, suitable for applications requiring fast signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable for digital circuits.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering and mechanical stability on circuit boards.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm offers compatibility with standard PCB layouts and facilitates easy soldering.

Minimum fmax: 24 MHz

Having a minimum fmax of 24MHz allows for high-speed signal processing and performance in digital circuits.

Maximum Supply Voltage (Vsup): 6 V

Supports a maximum supply voltage of 6V, providing a wide operating voltage range for flexibility in system design.

Technical Specifications

Latches & Flip-Flops M74HC109M1 attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

24000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Propagation Delay (tpd):

41 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC109M1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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