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M74HC107TTR

STMicroelectronics

M74HC107TTR by STMicroelectronics

M74HC107TTR by STMicroelectronics is a CMOS dual negative edge-triggered flip-flop with a 4.5V nominal voltage. It features a max frequency of 21 MHz, 50 pF load capacitance, and operates b/w -55 °C to 125 °C, ideal for military applications. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,352 parts In-Stock

1+ parts

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2,352

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Vyrian

USA . 2,008 parts In-Stock

1+ parts

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1k+ parts

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2,008

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Digiode

USA . 455 parts In-Stock

1+ parts

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100+ parts

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455

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,306 parts In-Stock

1+ parts

$14.650

100+ parts

-

1k+ parts

$13.185

10k+ parts

-

2,306

$14.650

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$13.185

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MKK Technologies

India . 2,256 parts In-Stock

1+ parts

$27.549

100+ parts

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10k+ parts

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2,256

$27.549

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DigiPath Technology Company

USA . 2,256 parts In-Stock

1+ parts

$27.549

100+ parts

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10k+ parts

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2,256

$27.549

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Corphita

USA . 2,369 parts In-Stock

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2,369

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Parana Technologies

USA . 680 parts In-Stock

1+ parts

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100+ parts

$17.516

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680

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$17.516

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Overview

Unlock the potential of your designs with the M74HC107TTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This reliable latch and flip-flop component excels in applications ranging from data storage to control systems, ensuring optimal performance even in demanding environments. With its robust construction and flexible operating range, the M74HC107TTR delivers efficiency and longevity, making it the ideal choice for engineers seeking precision and reliability in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space, facilitating high-density designs.

No. of Functions: 2

Having two functions provides flexibility in design, allowing for more complex logic operations in a compact package.

Package Shape: RECTANGULAR

The rectangular shape is optimal for high-density applications, enabling efficient layout and orientation on PCBs.

No. of Bits: 2

With two bits, it can process binary data more effectively, expanding the range of applications from basic to complex digital circuits.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V helps maintain power efficiency while delivering reliable performance.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for stable operation, ensuring minimal signal distortion and high-speed performance.

Power Supplies (V): 2/6

Support for a power supply range of 2 to 6V offers design flexibility, enabling use in a variety of voltage conditions.

No. of Terminals: 14

With 14 terminals, this product provides ample connection points for flexible circuit designs and integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile facilitate compact designs, making it suitable for modern electronic devices.

Maximum I (ol): 4 Amp

The capability to handle up to 4 Amps makes this product suitable for high-power applications.

Propagation Delay (tpd): 190 ns

A propagation delay of 190 ns ensures fast signal processing, ideal for high-speed digital applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature enhances reliability in extreme environments.

Trigger Type: NEGATIVE EDGE

Negative edge triggering is advantageous for applications requiring precise timing and synchronization.

Minimum Operating Temperature: -55 °C

The wide temperature range allows the product to function effectively in harsh environments, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances reliability and reduces oxidation, ensuring long-term connectivity.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, adapting to various design layouts.

Maximum Seated Height: 1.2 mm

The low seated height allows for better stacking in compact designs, optimizing space utilization.

Width: 4.4 mm

A small width enables use in tight spaces, ideal for compact electronic devices.

Output Polarity: COMPLEMENTARY

Complementary output allows for versatile circuit designs, enabling efficient logic operations.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage increases compatibility with a variety of power sources.

Length: 5 mm

The short length is suitable for space-constrained applications, ensuring versatility in design.

Temperature Grade: MILITARY

Military-grade temperature performance ensures reliability under extreme operational conditions.

Maximum Frequency At Nominal Supply: 21000000 Hz

With a maximum frequency of 21 MHz, this part is capable of supporting high-speed applications effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, enhancing the reliability of connections.

Packing Method: TR

Tape and reel (TR) packing ensures efficient handling and allows for automated assembly processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density layouts, accommodating compact circuit designs.

Minimum fmax: 25 MHz

The minimum frequency of 25 MHz guarantees sufficient speed for a wide range of digital applications.

Maximum Supply Voltage (Vsup): 6 V

The ability to operate at a maximum of 6V provides flexibility in power supply design, accommodating a range of applications.

Technical Specifications

Latches & Flip-Flops M74HC107TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

M74HC107TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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